Exchange-coupled film, method for making exchange-coupled film, and magnetic sensing element including exchange-coupled film

ABSTRACT

An exchange-coupled film includes a seed layer, an antiferromagnetic layer, and a ferromagnetic layer. The seed layer is formed at a thickness that is larger than the critical thickness, and the thickness of the seed layer is then decreased by etching so as to be smaller than or equal to the critical thickness. Thereby, a crystalline phase which extends through the seed layer from the upper surface to the lower surface can be formed, and/or the average size, in a direction parallel to the layer surface, of the crystal grains in the seed layer can be set to be larger than the thickness of the seed layer. Consequently, a large exchange coupling magnetic field Hex can be generated between the antiferromagnetic layer and the ferromagnetic layer.

RELATED APPLICATIONS

This patent document is a divisional application and claims the benefitpursuant to 35 U.S.C. § 121 of U.S. application Ser. No. 10/896,084filed on Jul. 21, 2004, which is currently pending and is herebyincorporated in its entirety by reference. This application also claimsbenefit of priority to Japanese Patent Application No. 2003-202760 filedon Jul. 29, 2003, herein incorporated in its entirety by reference.

BACKGROUND OF THE INVENTION

1. Technical Field

The present invention relates to an exchange-coupled film which includesa seed layer, an antiferromagnetic layer, and a ferromagnetic layerdisposed in that order from the bottom and in which the magnetizationdirection of the ferromagnetic layer is pinned in a predetermineddirection by an exchange coupling magnetic field generated at theinterface between the antiferromagnetic layer and the ferromagneticlayer; a method for making the exchange-coupled film; and a magneticsensing element including the exchange-coupled film. More particularly,the invention relates to an exchange-coupled film in which the totalthickness and shunt loss can be decreased by decreasing the thickness ofthe seed layer thereof, a method for making the exchange-coupled film,and a magnetic sensing element including the exchange-coupled film.

2. Description of the Related Art

FIG. 27 is a partial sectional view of a conventional magnetic sensingelement (spin-valve thin-film element), viewed from a surface facing arecording medium.

As shown in FIG. 27, an antiferromagnetic layer 50, a pinned magneticlayer 51, a nonmagnetic layer 52, a free magnetic layer 53, and aprotective layer 47 are disposed in that order on a seed layer 44 whichis, for example, composed of a NiFeCr alloy.

In such a spin-valve thin-film element, an exchange coupling magneticfield is generated at the interface between the antiferromagnetic layer50 and the pinned magnetic layer 51 by annealing, and the magnetizationof the pinned magnetic layer 51 is pinned in the height direction (inthe Y direction in the drawing).

In the spin-valve thin-film element shown in FIG. 27, hard bias layers 5a are disposed at both sides of a laminate including the seed layer 44to the protective layer 47, and the magnetization of the free magneticlayer 53 is aligned in the track width direction (in the X direction inthe drawing) by a longitudinal bias magnetic field from the hard biaslayers 5 a.

As shown in FIG. 27, electrode layers 8 a are disposed on the hard biaslayers 5 a. A sensing current from one of the electrode layers 8 amainly flows through three layers, i.e., the pinned magnetic layer 51,the nonmagnetic layer 52, and the free magnetic layer 53.

In the spin-valve thin-film element shown in FIG. 27, by providing theseed layer 44 under the antiferromagnetic layer 50, an improvement incurrent-carrying reliability, for example, electromigration resistance,and an improvement in the rate of change in resistance are expected.

It is believed to be important that the seed layer 44 has laface-centered cubic crystal structure (fcc structure) and the equivalentcrystal plane represented as (111) plane is preferentially orientedparallel to the layer surface.

If the seed layer 44 has the fcc structure with the {111} orientation,the individual layers can be formed on the seed layer 44 properly so asto have the {111} orientations of fcc structures. It is also possible toincrease the crystal grain sizes. Consequently, scattering of conductionelectrons in the grain boundaries can be reduced, resulting in animprovement in electrical conduction. The magnitude of the exchangecoupling magnetic field generated between the pinned-magnetic layer 51and the antiferromagnetic layer 50 can also be increased, resulting inan improvement in current-carrying reliability.

Conventionally, the seed layer 44 is composed of a NiFeCr alloy or NiCralloy as disclosed in Japanese Unexamined Patent Application PublicationNo. 2003-101102.

Recently, there has been an increased demand for gap-narrowing anddecreases in shunt loss in magnetic sensing elements, and furtherdecreases in the thicknesses of the individual layers constitutingmagnetic sensing elements have been required.

The conventional seed layer has a thickness of about 50 Å. If thethickness of the seed layer is decreased so as to be smaller than thecritical thickness, the magnitude of the exchange coupling magneticfield Hex between the antiferromagnetic layer and the ferromagneticlayer disposed on the seed layer is extremely decreased, resulting in arapid degradation in the change in resistance ΔRs and the rate of changein resistance ΔRs/Rs.

Laminates having the structure descried below were formed for testing.Changes in the rate of change in resistance ΔRs/Rs, change in resistanceΔRs, sheet resistance Rs, and unidirectional exchange bias magneticfield Hex* with the thickness of the seed layer composed of(Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ were investigated.

Substrate/Alumina/Seed layer [Ni.FeCr]/Antiferromagnetic layer [PtMn(140 Å)]/Pinned magnetic layer [CoFe (16 Å)/Ru (8.7 Å)/CoFe (22Å)]/Nonmagnetic layer [Cu (21 Å)]/Free magnetic layer [CoFe (10 Å)/NiFe(35 Å)]/Protective layer [Ta (30 Å)]

The results thereof are shown in FIGS. 28 to 31. FIG. 28 is a graphshowing the measurement results of the sheet resistance Rs; FIG. 29 is agraph showing the measurement results of the unidirectional exchangebias magnetic field Hex* of the pinned magnetic layer; FIG. 30 is agraph showing the measurement results of the rate of change inresistance ΔRs/Rs; and FIG. 31 is a graph showing the measurementresults of the change in resistance ΔRs.

As shown in FIGS. 28 and 29, if the thickness of the seed layer becomes38 Å or less, the sheet resistance Rs of the magnetic sensing elementrapidly increases, and the unidirectional exchange bias magnetic fieldHex* rapidly decreases. As shown in FIGS. 30 and 31, if the thickness ofthe seed layer becomes 38 Å or less, the rate of change inmagnetoresistance ΔRs/Rs and the change in resistance ΔRs rapidlydecrease.

The thickness of the seed layer at the critical point below which theunidirectional exchange bias magnetic field Hex*, change in resistanceΔRs, and rate of change in resistance ΔRs/Rs of the laminateconstituting the magnetic sensing element rapidly decrease is referredto as a critical thickness of the seed layer.

As described above, because the seed layer has the critical thicknessbelow which the change in resistance ΔRs and the rate of change inresistance ΔRs/Rs rapidly decrease, it has not been possible to form anexchange-coupled film in which the thickness of the seed layer issmaller than or equal to the critical thickness or a magnetic sensingelement including such an exchange-coupled film.

BRIEF SUMMARY

The present invention has been achieved in order to overcome theproblems described above. It is an object of the present invention toprovide an exchange-coupled film in which even if the thickness of theseed layer is decreased so as to be smaller than the critical thickness,a strong exchange coupling magnetic field Hex can be generated betweenthe antiferromagnetic layer and the ferromagnetic layer, and a methodfor making the exchange-coupled film. It is also an object of thepresent invention to provide a magnetic sensing element in which thetotal thickness and the shunt loss can be decreased by using theexchange-coupled film.

In one aspect of the present invention, an exchange-coupled filmincludes a seed layer, an antiferromagnetic layer, and a ferromagneticlayer disposed in that order from the bottom, the magnetization of theferromagnetic layer being directed in a predetermined direction by anexchange coupling magnetic field generated at the interface between theantiferromagnetic layer and the ferromagnetic layer. The seed layer hasa thickness that is smaller than or equal to the critical thickness, andthe seed layer has a crystalline phase which extends through from theupper surface to the lower surface of the seed layer.

The present inventors have found that, with respect to anexchange-coupled film in which an antiferromagnetic layer and aferromagnetic layer are disposed on a seed layer, when a strong exchangecoupling magnetic field Hex is generated between the antiferromagneticlayer and the ferromagnetic layer, the seed layer has a crystallinephase including columnar grains which extend through from the uppersurface to the lower surface of the seed layer.

However, if the seed layer of the exchange-coupled film is formed simplywith a thickness that is smaller than the critical thickness, the sizeof the crystal grains formed in the seed layer becomes very small, andthe crystalline phase including the columnar grains which extend throughfrom the upper surface to the lower surface of the seed layer ceases tobe present. Therefore, if the thickness of the seed layer of theconventional exchange-coupled film is set to be smaller than thecritical thickness, the exchange coupling magnetic field Hex is rapidlydecreased.

In contrast, in the present invention, by employing a method for makingan exchange-coupled film which will be described below, it has becomepossible for the first time to provide the seed layer having a thicknessthat is smaller than or equal to the critical thickness and including acrystalline phase including an aggregate of columnar grains which extendthrough from the upper-surface to the lower surface of the seed layer.

In another aspect of the present invention, an exchange-coupled filmincludes a seed layer, an antiferromagnetic layer, and a ferromagneticlayer disposed in that order from the bottom, the magnetization of theferromagnetic layer being directed in a predetermined direction by anexchange coupling magnetic field generated at the interface between theantiferromagnetic layer and the ferromagnetic layer. The seed layer is ametal layer having a thickness that is smaller than or equal to thecritical thickness and having a crystalline phase. The average crystalgrain size, in a direction parallel to the layer surface, of the crystalgrains in the seed layer is larger than the thickness of the seed layer.

In an exchange-coupled film in which an antiferromagnetic layer and aferromagnetic layer are disposed on a seed layer, in order to generate astrong exchange coupling magnetic field Hex between theantiferromagnetic layer and the ferromagnetic layer, the size of thecrystal grains in the seed layer must be large.

However, if the seed layer of the exchange-coupled film is formed simplywith a thickness that is smaller than the critical thickness, the sizeof the crystal grains in the seed layer becomes extremely small, and theexchange coupling magnetic field Hex is rapidly decreased.

In contrast, in the present invention, by employing a method for formingan exchange-coupled film which will be described below, it has becomepossible for the first time to provide the seed layer in which even ifthe thickness is smaller than or equal to the critical thickness, thesize of the crystal grains in the seed layer can be increased, and theaverage crystal grain size, in a direction parallel to the layersurface, of the seed layer is larger than the thickness of the seedlayer

In the present invention, preferably, the crystalline phase of the seedlayer has a face-centered cubic (fcc) structure and the equivalentcrystal plane represented as (111) plane is preferentially orientedparallel to the interface.

Preferably, the seed layer is composed of a NiCr alloy or a NiFeCralloy.

In another aspect of the present invention, an exchange-coupled filmincludes a seed layer, an antiferromagnetic layer, and a ferromagneticlayer disposed in that order from the bottom, the magnetization of theferromagnetic layer being directed in a predetermined direction by anexchange coupling magnetic field generated at the interface between theantiferromagnetic layer and the ferromagnetic layer. The seed layer iscomposed of a NiCr alloy or a NiFeCr alloy. The Cr content in the NiCralloy or the NiFeCr alloy is 35 to 60 atomic percent, and the thicknessof the seed layer is smaller than or equal to the critical thickness.

When the seed layer is composed of the NiCr alloy or the NiFeCr alloy,if the Cr content is increased, the crystal grain size in the in-planedirection of the crystal grains in the seed layer can be increased.Consequently, the crystal grain sizes in the in-plane direction of theferromagnetic layer and other layers formed on the seed layer are alsoincreased. As a result, the grain boundary densities in these layers aredecreased, and it is possible to decrease the spin-independentscattering effect at the grain boundaries. The exchange couplingmagnetic field Hex between the antiferromagnetic layer and theferromagnetic layer can also be strengthened. If the Cr content isincreased, the resistivity of the seed layer is increased, resulting ina reduction in shunt loss.

However, if the Cr content in the NiCr alloy or the NiFeCr alloy isincreased, the critical thickness of the seed layer is increased.Therefore, in the conventional exchange-coupled film, there is no otherchoice but to increase the thickness of the seed layer. As a result, therate of change in resistance ΔR/R is decreased because of shunt loss.

In contrast, in the present invention, regardless of the Cr content inthe NiCr alloy or the NiFeCr alloy, the seed layer can be formed at athickness smaller than or equal to the critical thickness, and moreover,a satisfactory exchange coupling magnetic field Hex can be obtained.

In the present invention, preferably, the Cr content in the NiCr alloyor the NiFeCr alloy is 40 to 60 atomic percent, and the thickness of theseed layer is larger than 0 Å and smaller than or equal to 38 Å.

Preferably, the Cr content in the NiCr alloy or the NiFeCr alloy is 35to 60 atomic percent, and the thickness of the seed layer is larger than0 Å and smaller than or equal to 30 Å. More preferably, the Cr contentin the NiCr alloy or the NiFeCr alloy is 50 atomic percent or less.

In the NiFeCr alloy, preferably, the Fe/Ni atomic ratio is greater than0/100 and less than or equal to 30/70.

The thickness of the seed layer is more preferably 6 or more and mostpreferably 12 Å or more.

In another aspect of the present invention, a magnetic sensing elementincludes a seed layer, an antiferromagnetic layer, a pinned magneticlayer, a nonmagnetic layer, and a free magnetic layer disposed in thatorder from the bottom, the magnetization of the free magnetic layerbeing aligned in a direction substantially perpendicular to themagnetization direction of the pinned magnetic layer. The seed layer,the antiferromagnetic layer, and the pinned magnetic layer correspond toany one of the exchange-coupled films of the present invention describedabove.

In another aspect of the present invention, a magnetic sensing elementincludes a seed layer, an antiferromagnetic exchange bias layer, a freemagnetic layer, a nonmagnetic layer, a pinned magnetic layer, and anantiferromagnetic layer disposed in that order from the bottom, themagnetization of the free magnetic layer being aligned in a directionsubstantially perpendicular to the magnetization direction of the pinnedmagnetic layer. The seed layer, the exchange bias layer, and the freemagnetic layer correspond to any one of the exchange-coupled films ofthe present invention described above.

In another aspect of the present invention, a magnetic sensing elementincludes a free magnetic layer, an upper nonmagnetic layer disposed onthe free magnetic layer, a lower nonmagnetic layer disposed under thefree magnetic layer, an upper pinned magnetic layer disposed on theupper nonmagnetic layer, a lower pinned magnetic layer disposed underthe lower nonmagnetic layer, an upper antiferromagnetic layer disposedon the upper pinned magnetic layer; a lower antiferromagnetic layerdisposed under the lower pinned magnetic layer, and a seed layerdisposed under the lower antiferromagnetic layer, the magnetization ofthe free magnetic layer being aligned in a direction substantiallyperpendicular to the magnetization direction of the upper pinnedmagnetic layer and the lower pinned magnetic layer. The seed layer, thelower antiferromagnetic layer, and the lower pinned magnetic layercorrespond to any one of the exchange-coupled films described above.

In another aspect of the present invention, a magnetic sensing elementincludes a seed layer, an antiferromagnetic exchange bias layer, amagnetoresistive layer, a nonmagnetic layer, and a soft magnetic layer.The seed layer, the exchange bias layer, and the magnetoresistive layercorrespond to any one of the exchange-coupled films described above.

In the magnetic sensing element of the present invention, even if thethickness of the seed layer is decreased so as to be smaller than thecritical thickness so that the total thickness and the shunt loss aredecreased, since a strong exchange coupling magnetic field Hex can begenerated between the antiferromagnetic layer and the ferromagneticlayer, a large change in resistance ΔRs and a high rate of change inresistance ΔRs/Rs can be maintained.

In another aspect of the present invention, a magnetic sensing elementincludes, a pinned magnetic layer, a free magnetic layer, and anonmagnetic layer interposed between the pinned magnetic layer and thefree magnetic layer. The pinned magnetic layer includes a plurality ofmagnetic sublayers, the two adjacent magnetic sublayers being separatedby a nonmagnetic intermediate sublayer, the plurality of magneticsublayers including a first magnetic sublayer located farthest from thenonmagnetic layer. The first magnetic sublayer is in contact with anonmagnetic metal layer composed of a PtMn alloy or an X—Mn alloy,wherein X is at least one element selected from the group consisting ofPt, Pd, Ir, Rh, Ru, Os, Ni, and Fe. The crystals in the nonmagneticmetal layer and the crystals in the first magnetic sublayer areepitaxial or heteroepitaxial. The end face of the pinned magnetic layerfacing a recording medium is exposed. The nonmagnetic metal layer isdisposed on the seed layer of the present invention described above.

In the magnetic sensing element of the present invention, even if thethickness of the seed layer is decreased so as to be smaller than thecritical thickness so that the total thickness and the shunt loss aredecreased, the magnetization of the pinned magnetic layer can bestrongly pinned in a predetermined direction. Thereby, a large change inresistance ΔRs and a high rate of change in resistance ΔRs/Rs can bemaintained.

In another aspect of the present invention, a method for making anexchange-coupled film includes the steps of:

(a) forming a seed layer at a thickness that is larger than the criticalthickness so that columnar grains in the crystalline phase extendthrough from the upper surface to the lower surface of the seed layer;

(b) etching the upper surface of the seed layer so that the thickness ofthe seed layer is smaller than or equal to the critical thickness; and

(c) depositing an antiferromagnetic layer and a ferromagnetic layer onthe seed layer.

In the method for making the exchange-coupled film of the presentinvention, first, a seed layer is formed at a thickness that is largerthan the critical thickness so that columnar grains in the crystallinephase extend through from the upper surface to the lower surface of theseed layer. The thickness of the seed layer is then decreased so as tobe smaller than or equal to the critical thickness by etching. Once thecolumnar grains in the crystalline phase which extend through from theupper surface to the lower surface of the seed layer are formed, even ifthe seed layer is etched, the shape of the columnar grains in thecrystalline phase is maintained so that the columnar grains extendthrough from the upper surface to the lower surface.

Consequently, by using the method for making the exchange-coupled filmof the present invention, even if the thickness of the seed layer isdecreased so as to be smaller than the critical thickness, it ispossible to obtain an exchange-coupled film capable of producing astrong exchange coupling magnetic field Hex between theantiferromagnetic layer and the ferromagnetic layer.

In another aspect of the present invention, a method for making anexchange-coupled film includes the steps of:

(d) forming a seed layer with a crystalline phase at a thickness that islarger than the critical thickness;

(e) etching a surface of the seed layer so that the thickness of theseed layer is smaller than or equal to the critical thickness and sothat the average crystal grain size, in a direction parallel to thelayer surface, of the crystal grains in the seed layer is larger thanthe thickness of the seed layer; and

(f) depositing an antiferromagnetic layer and a ferromagnetic layer onthe seed layer.

In the method for making the exchange-coupled film of the presentinvention, first, a seed layer is formed at a thickness that is largerthan the critical thickness, and the thickness of the seed layer is thendecreased so as to be smaller than or equal to the critical thickness byetching. If the seed layer is formed at a thickness that is larger thanthe critical thickness, the size of the crystal grains formed in theseed layer becomes sufficiently large. Even if the seed layer is etchedafter the formation, the crystal grain size of the crystals formed inthe seed layer is maintained.

Consequently, by using the method for making the exchange-coupled filmof the present invention, even if the thickness of the seed layer isdecreased so as to be smaller than the critical thickness, the averagecrystal grain size, in a direction parallel to the layer surface, of thecrystal grains in the seed layer can be set to be larger than thethickness of the seed layer, and it is possible to obtain anexchange-coupled film capable of producing a strong exchange couplingmagnetic field Hex between the antiferromagnetic layer and theferromagnetic layer.

In the present invention, in step (a) or step (d), preferably, the seedlayer is formed using a metal material which has a face-centered cubic(fcc) structure and a crystalline phase in which the equivalent crystalplane represented as {111} plane is preferentially oriented parallel tothe interface between the antiferromagnetic layer and the ferromagneticlayer.

In the present invention, the seed layer is, for example, composed of aNiCr alloy or a NiFeCr alloy.

In another aspect of the present invention, a method for making anexchange-coupled film includes the steps of:

(g) forming a seed layer at a thickness that is larger than the criticalthickness using a NiCr alloy or a NiFeCr alloy with a Cr content of 35to 60 atomic percent;

(h) etching a surface of the seed layer so that the thickness of theseed layer is smaller than or equal to the critical thickness; and

(i) depositing an antiferromagnetic layer and a ferromagnetic layer onthe seed layer.

In the method for making the exchange-coupled film of the presentinvention, first, a seed layer is formed at a thickness that is largerthan the critical thickness, and the thickness of the seed layer is thendecreased so as to be smaller than or equal to the critical thickness byetching. In the present invention, regardless of the Cr content in theNiCr alloy or the NiFeCr alloy, the seed layer can be formed at athickness that is smaller than or equal to the critical thickness, andmoreover, it is possible to obtain a satisfactory exchange couplingmagnetic field Hex.

Preferably, the Cr content in the NiCr alloy or the NiFeCr alloy is 40to 60 atomic percent, and in step (b), (e), or (h), the seed layer isetched so that the thickness of the seed layer is larger than 0 Å andsmaller than or equal to 38 Å.

More preferably, the Cr content in the NiCr alloy or the NiFeCr alloy is35 to 60 atomic percent, and in step (b), (e), or (h), the seed layer isetched so that the thickness of the seed layer is larger than 0 Å andsmaller than or equal to 30 Å.

Most preferably, the Cr content in the NiCr alloy or the NiFeCr alloy is50 atomic percent or less.

In the NiFeCr alloy, preferably, the Fe/Ni atomic ratio is greater than0/0100 and less than or equal to 30/70.

The thickness of the seed layer is more preferably 6 Å or more, and mostpreferably 12 Å or more.

When a self-pinned magnetic sensing element is fabricated, instead ofstep (c), (f), or (i), step (j) of depositing a ferromagnetic layer onthe seed layer is performed.

Additionally, as in the present invention, when the surface of the seedlayer is etched, the Cr concentration at the outermost surface of thefinished seed layer may be slightly lower than the Cr concentrationinside the seed layer and the Ni concentration at the outermost surfaceof the finished seed layer may be slightly higher than the Niconcentration inside the seed layer. If such a concentration gradientoccurs, it is believed that the surface energy of the seed layerchanges, and the wettability of the surface of the seed layer improves,resulting in an increase in the exchange coupling magnetic field Hexbetween the antiferromagnetic layer and the ferromagnetic layer. Thisconcentration gradient is caused by the step of etching the surface ofthe seed layer and does not occur in the conventional seed layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a magnetic sensing element (singlespin-valve magnetoresistive element) in a first embodiment of thepresent invention, viewed from a surface facing a recording medium;

FIG. 2 is a sectional view of a magnetic sensing element (singlespin-valve magnetoresistive element) in a second embodiment of thepresent invention, viewed from a surface facing a recording medium;

FIG. 3 is a sectional view of a magnetic sensing element (dualspin-valve magnetoresistive element) in a third embodiment of thepresent invention, viewed from a surface facing a recording medium;

FIG. 4 is a sectional view of a magnetic sensing element (anisotropicmagnetoresistive (AMR) element) in a fourth embodiment of the presentinvention, viewed from a surface facing a recording medium;

FIG. 5 is a sectional view of a magnetic sensing element (self-pinnedmagnetoresistive element) in a fifth embodiment of the presentinvention, viewed from a surface facing a recording medium;

FIG. 6 is a plan view of the magnetic sensing element in the fifthembodiment of the present invention;

FIG. 7 is a transmission electron micrograph of a magnetic sensingelement of the present invention;

FIG. 8 is a schematic diagram of the transmission electron micrograph ofthe magnetic sensing element of the present invention shown in FIG. 7;

FIG. 9 is a transmission electron micrograph of a conventional magneticsensing element;

FIG. 10 is a transmission electron micrograph of a conventional magneticsensing element;

FIG. 11 is a schematic diagram of the transmission electron micrographof the conventional magnetic sensing element shown in FIG. 9;

FIG. 12 is a schematic diagram of the transmission electron micrographof the conventional magnetic sensing element shown in FIG. 10;

FIG. 13 is a graph which shows the relationships between the thicknessof finished seed layers and the rate of change in resistance in themagnetic sensing element of the present invention and the conventionalmagnetic sensing element;

FIG. 14 is a graph which shows the relationships between the thicknessof finished seed layers and the change in sheet resistance in themagnetic sensing element of the present invention and the conventionalmagnetic sensing element;

FIG. 15 is a graph which shows the relationships between the thicknessof finished seed layers and the sheet resistance in the magnetic sensingelement of the present invention and the conventional magnetic sensingelement;

FIG. 16 is a graph which shows the relationships between the thicknessof finished seed layers and the unidirectional exchange bias magneticfield (Hex*) in the magnetic sensing element of the present inventionand the conventional magnetic sensing element;

FIG. 17 is a graph which shows the relationship between the Cr contentand the critical thickness of seed layers composed of NiFeCr;

FIG. 18 is a graph which shows the relationship between the Cr contentand the average crystal grain size of conventional seed layers composedof NiFeCr;

FIG. 19 is a graph which shows the relationship between the Cr contentand the rate of change in magnetoresistance of magnetic sensing elementsincluding conventional seed layers composed of NiFeCr;

FIG. 20 is a graph which shows the relationship between the Cr contentand the average crystal grain size of seed layers composed of NiFeCr inthe present invention;

FIG. 21 is a graph which shows the relationship between the Cr contentand the rate of change in magnetoresistance of seed layers composed ofNiFeCr in the present invention;

FIG. 22 is a graph which shows the relationship between the Fe contentand the critical thickness of teed layers composed of NiFeCr;

FIG. 23 is a graph which shows the relationship between the Fe contentand the average crystal grain size of conventional seed layers composedof NiFeCr;

FIG. 24 is a graph which shows the relationship between the Fe contentand the rate of change in magnetoresistance of magnetic sensing elementsincluding conventional seed layers composed of NiFeCr;

FIG. 25 is a graph which shows the relationship between the Fe contentand the average crystal grain size of seed layers composed of NiFeCr inthe present invention;

FIG. 26 is a graph which shows the relationship between the Fe contentand the rate of change in magnetoresistance of magnetic sensing elementsincluding seed layers composed of NiFeCr in the present invention;

FIG. 27 is a sectional view of a conventional magnetic sensing element,viewed from a surface facing a recording medium;

FIG. 28 is a graph which shows the relationship between the thickness offinished seed layers and the sheet resistance of conventional magneticsensing elements;

FIG. 29 is a graph which shows the relationship between the thickness offinished seed layers and the unidirectional exchange bias magnetic field(Hex*) of conventional magnetic sensing elements;

FIG. 30 is a graph which shows the relationship between the thickness offinished seed layers and the rate of change in magnetoresistance ofconventional magnetic sensing elements; and

FIG. 31 is a graph which shows the relationship between the thickness offinished seed layers and the change in sheet resistance of conventionalmagnetic sensing elements.

DETAILED DESCRIPTION OF THE DRAWINGS AND THE PRESENTLY PREFERREDEMBODIMENTS

FIG. 1 is a sectional view which shows an overall structure of amagnetic sensing element (single spin-valve magnetoresistive element) ina first embodiment of the present invention, viewed from a surfacefacing a recording medium. FIG. 1 shows only a central region of theelement extending in the X direction.

The single spin-valve magnetoresistive element is mounted on thetraining end of a floating-type slider provided on a hard disk drive orthe like to detect magnetic fields recorded on a hard disk or the like.The magnetic recording medium, such as a hard disk, travels in the Zdirection, and a leakage magnetic field from the magnetic recordingmedium is applied in the Y direction.

As shown in FIG. 1, a seed layer 22, an antiferromagnetic layer 4, apinned magnetic layer 3, a nonmagnetic layer 2, and a free magneticlayer 1 are disposed on an insulating layer 6 composed of alumina or thelike. Additionally, an underlayer composed of a nonmagnetic material,such as at least one element selected from the group consisting of Ta,Hf, Nb, Zr, Ti, Mo, and W, maybe disposed under the seed layer 22.

The antiferromagnetic layer 4 disposed on the seed layer 22 ispreferably composed of an antiferromagnetic material containing X andMn, wherein X is at least one element ′ selected from the groupconsisting of Pt, Pd, Ir, Rh, Ru, and Os.

The X—Mn alloys containing such platinum group elements have excellentcharacteristics as antiferromagnetic materials because they exhibitsuperior corrosion resistance and high blocking temperatures and cangenerate large exchange coupling magnetic fields (Hex). In particular,Pt is preferable among the platinum group elements. For example, abinary PtMn alloy may be used.

In the present invention, the antiferromagnetic layer 4 may be composedof an antiferromagnetic material containing X, X′, and Mn, wherein X′ isat least one element selected from the group consisting of Ne, Ar, Kr,Xe, Be, B, C, N, Mg, Al, Si, P, Ti, V, Cr, Fe, Co, Ni, Cu, Zn, Ga, Ge,Zr, Nb, Mo, Ag, Cd, Sn, Hf, Ta, W, Re, Au, Pb, and rare-earth elements.

Preferably, an element or elements which form a solid solution byentering the interstices in the space lattice composed of X and Mn or bypartially replacing the lattice points in the crystal lattice composedof X and Mn are used as X′. Herein, the term “solid solution” refers toa solid in which its components are homogeneously mixed over wideranges.

The X—Mn—X′ alloy as the interstitial or substitutional solid solutionhas a larger lattice constant compared with that of the X—Mn alloy. As aresult, the difference between the lattice constant of theantiferromagnetic layer 4 and that of the pinned magnetic layer 3 can beincreased so that a noncoherent state is brought about easily in theinterface structure between the antiferromagnetic layer 4 and the pinnedmagnetic layer 3. Herein, the term “noncoherent state” refers to a statein which the atoms constituting the antiferromagnetic layer 4 and theatoms constituting the pinned magnetic layer 3 do not exhibit one-to-onecorrespondence at the interface between the antiferromagnetic layer 4and the pinned magnetic layer 3.

When an element or elements which form a substitutional solid solutionare used as X′, if the X′ content becomes excessive, theantiferromagnetic characteristics are degraded, and the magnitude of theexchange coupling magnetic field generated at the interface with thepinned magnetic layer 3 is decreased. In the present invention, X′ ispreferably at least one inert rare gas element selected from the groupconsisting of Ne, Ar, Kr, and Xe which forms an interstitial solidsolution. Since rare gas elements are inert, these gases do notsubstantially affect the antiferromagnetic characteristics even whenthey are contained in the layers. Moreover, for example, Ar, which iscommonly used as a sputtering gas in sputtering apparatuses, can readilyenter the layer by simply adjusting the gas pressure properly.

When a gaseous element or elements are used as X′, it is difficult forthe layer to contain a large amount of the element X′. However, by onlyallowing a small amount of these rare gases to enter the layer, theexchange coupling magnetic field generated by annealing can beremarkably increased.

In the present invention, the X′ content is preferably 0.2 to 10 atomicpercent, and more preferably 0.5 to 5 atomic percent. Since Pt ispreferred as X in the present invention, a Pt—Mn—X′ alloy is preferablyused.

In the present invention, the X content or the X+X′ content in theantiferromagnetic layer 4 is preferably in the range of 45 to 60 atomicpercent, and more preferably in the range of 49 to 56.5 atomic percent.Consequently, the interface with the pinned magnetic layer 3 is put intoa noncoherent state during deposition, and moreover, theantiferromagnetic layer 4 can achieve an adequate order transformationby annealing.

The pinned magnetic layer 3 disposed on the antiferromagnetic layer 4has a five-layered structure. The pinned magnetic layer 3 includes amagnetic sublayer 11, a nonmagnetic intermediate sublayer 12, a magneticsublayer 13, a specular reflection layer 16, and a magnetic sublayer 23.The magnetization directions of the magnetic sublayer 11 and themagnetic sublayers 13 and 23 are set to be antiparallel to each other(the magnetization directions of the magnetic sublayers 13 and 23 beingparallel to each other) due to an exchange coupling magnetic field atthe interface with the antiferromagnetic layer 4 and anantiferromagnetic exchange coupling magnetic field (RKKY interaction)generated via the nonmagnetic intermediate sublayer 12. Thisantiparallel state is called as a synthetic ferrimagnetic couplingstate. Such a structure can stabilize the magnetization of the pinnedmagnetic layer 3 and also increase the apparent exchange couplingmagnetic field generated at the interface between the pinned magneticlayer 3 and the antiferromagnetic layer 4.

In this embodiment, the specular reflection layer 16 is disposed betweenthe magnetic sublayer 13 and the magnetic sublayer 23. By providing thespecular reflection layer 16, spin-up conduction electrons among theconduction electrons moving through the nonmagnetic layer 2 when asensing current is applied can be specularly reflected at the interfacebetween the specular reflection layer 16 and the magnetic sublayer 23with the spin direction being maintained. Thereby, the mean free path ofthe spin-up electrons are extended and the difference in the mean freepath between the spin-up electrons and spin-down electrons is increased,resulting in an increase in the rate of change in resistance (ΔRs/Rs).

With respect to the specular reflection layer 16, after the magneticsublayer 13 is formed, the surface of the magnetic sublayer 13 isoxidized, and the oxidized portion of the magnetic sublayer 13 may beallowed to function as the specular reflection layer 16. For example,the magnetic sublayer 13 is composed of a CoFe alloy, and the surfacethereof is oxidized. Thereby, a specular reflection layer 16 composed ofCo—Fe—O can be formed on the surface of the magnetic sublayer 13. In thepresent invention, preferably, the magnetic sublayers 11 and 23 are alsocomposed of a CoFe alloy. Alternatively, the magnetic sublayers 11, 13,and 23 may be composed of a magnetic material, such as a NiFe alloy, aCoFeNi alloy, or Co.

In another method, a specular reflection layer 16 composed of FeMO orthe like, wherein M is at least one element selected from the groupconsisting of Mn, Co, Ni, Ba, Sr, Y, Gd, Cu, and Zn, is formed bysputtering on the magnetic sublayer 13 or directly on the nonmagneticintermediate sublayer 12 without forming the magnetic sublayer 13, andthe magnetic sublayer 23 is then formed thereon.

In the embodiment shown in FIG. 1, the pinned magnetic layer 3 has alaminated ferrimagnetic structure. The pinned magnetic layer 3 may havea single-layered structure or a multilayered structure includingmagnetic sublayers.

The magnetic sublayer 11, for example, has a thickness of 12 to 20 Å,the nonmagnetic intermediate sublayer 12 has a thickness of about 8 Å,and each of the magnetic sublayers 11 and 13 has a thickness of 5 to 20Å.

The nonmagnetic intermediate sublayer 12 is composed of a nonmagneticconductive material, such as Ru, Rh, Ir, Cr, Re, or Cu.

The nonmagnetic layer 2 disposed on the pinned magnetic layer 3 is, forexample, composed of Cu. When the magnetic sensing element of thepresent invention is applied to a tunneling magnetoresistive element(TMR element) utilizing the tunneling effect, the nonmagnetic layer 2 iscomposed of an insulating material, such as Al₂0₃.

The free magnetic layer 1 having a two-layered structure is disposed onthe nonmagnetic layer 2.

The free magnetic layer 1, for example, includes a NiFe alloy sublayer 9and a CoFe alloy sublayer 10. As shown in FIG. 1, by forming the CoFealloy sublayer 10 so as to be in contact with the nonmagnetic layer 2,diffusion of metallic elements, etc., can be prevented at the interfacewith the nonmagnetic layer 2, and the rate of change in resistance(ΔRs/Rs) can be increased.

The NiFe alloy sublayer 9, for example, contains 80 atomic percent of Niand 20 atomic percent of Fe. The CoFe alloy sublayer 10, for example,contains 90 atomic percent of Co and 10 atomic percent of Fe. Forexample, the NiFe alloy sublayer 9 has a thickness of about 35 Å, andthe CoFe alloy sublayer 10 has a thickness of about 10 Å. Instead of theCoFe alloy sublayer 10, Co, CoFeNi alloy, or the like may be used. Thefree magnetic layer 1 may have a single-layered structure or amultilayered structure including magnetic sublayers. In such a case, thefree magnetic layer 1 preferably has a single-layered structure composedof a CoFeNi alloy. The free magnetic layer 1 may have a laminatedferrimagnetic structure as in the pinned magnetic layer 3.

A back layer 15 composed of a metal or nonmagnetic metal, such as Cu,Au, or Ag, is disposed on the free magnetic layer 1. For example, thethickness of the back layer 15 is 20 or less.

A protective layer 7 is disposed on the back layer 15. The protectivelayer 7 is preferably a specular reflection layer composed of an oxideof Ta or the like.

By disposing the back layer 15, the mean free path of spin-up electronswhich contribute to the magnetoresistance effect can be extended, and alarge rate of change in resistance (ΔRs/Rs) can be obtained in thespin-valve magnetic element because of a so-called “spin filter effect”,and thus the magnetic element becomes suitable for higher recordingdensities. Additionally, the back layer 15 may be omitted.

By providing the specular reflection layer 7 on the back layer 15,spin-up conduction electrons can be specularly reflected at the specularreflection layer 7 so that the mean free path of conduction electronscan be extended, resulting in a further improvement in the rate ofchange in resistance (ΔRs/Rs).

Examples of materials used for the specular reflection layer 7 include,in addition to the oxide of Ta, oxides, such as Fe—O (e.g., α-Fe₂O₃,FeO, and Fe₃O₄), Ni—O, Co—O, Co—Fe—O, Co—Fe—NiO, Al—O, Al-Q-O (wherein Qis at least one element selected from the group consisting of B, Si, N,Ti, V, Cr, Mn, Fe, Co, and Ni), and R—O (wherein R is at least oneelement selected from the group consisting of Ti, V, Cr, Zr, Nb, Mo, Hf,and W); nitrides, such as Al—N, Al-Q-N (wherein Q is at least oneelement selected from the group consisting of B, Si, O, Ti, V, Cr, Mn,Fe, Co, and Ni), and R—N (wherein R is at least one element-selectedfrom the group consisting of Ti, V, Cr, Zr; Nb, Mo, Hf, Ta, and W); andsemimetallic Heusler alloys, such as NiMnSb and PtMnSb. These materialsare also applicable to the specular reflection layer 16 formed in thepinned magnetic layer 3.

In the embodiment shown in FIG. 1, hard bias layers 5 and electrodelayers 8 are disposed at both sides of the laminated film including theinsulating layer 6 to the protective layer (specular reflection layer)7. The magnetization of the free magnetic layer 1 is aligned in thetrack width direction (in the X direction in the drawing) by alongitudinal magnetic field from the hard bias layers 5.

The hard bias layers 5 are composed of a Co—Pt alloy, a Co—Cr—Pt alloy,or the like. The electrode layers 8 are composed of a Ta, Au, Cr, Cu,Rh, Ir, Ru, W, or the like. Additionally, in the tunnelingmagnetoresistive element described above or a magnetic sensing elementof a current-perpendicular-to-the-plane (CPP) type, one of the electrodelayers 8 is formed above the free magnetic layer 1 and the other isformed below the antiferromagnetic layer 4. In such a case, the specularreflection layer 16 is not formed.

In the spin-valve thin-film element shown in FIG. 1, after the layersfrom the insulating layer 6 to the protective layer 7 are deposited,annealing is performed to generate an exchange coupling magnetic fieldat the interface between the antiferromagnetic layer 4 and the pinnedmagnetic layer 3. At this stage, by directing the magnetic fieldparallel to the Y direction, the magnetization of the pinned magneticlayer 3 is directed and pinned parallel to the Y direction. In theembodiment shown in FIG. 1, since the pinned magnetic layer 3 has alaminated ferrimagnetic structure, when the magnetic sublayer 11 ismagnetized, for ′ example, in the Y direction, the magnetic sublayer 13and the magnetic sublayer 23 are magnetized in a direction opposite tothe Y direction.

In this embodiment, the seed layer 22 is disposed under theantiferromagnetic layer 4. The seed layer 22 is a metal layer composedof a NiFeCr alloy or NiCr alloy. The Cr content in the NiFeCr alloy orNiCr alloy is 35 to 60 atomic percent.

In the present invention, the thickness of the seed layer 22 is smallerthan or equal to the critical thickness of the seed layer 22. Thethickness of the seed layer 22 at the critical point below which theexchange coupling magnetic field Hex at the interface between theantiferromagnetic layer 4 and the pinned magnetic layer 3, theunidirectional exchange bias magnetic field Hex*, and the change inresistance ΔRs and the rate of change in magnetoresistance ΔRs/Rs of themagnetic sensing element rapidly decrease is referred to as a criticalthickness of the seed layer 22.

If a seed layer is formed at a thickness that is smaller than or equalto the critical thickness, the change in resistance ΔRs and the rate ofchange in magnetoresistance ΔRs/Rs of a thin-film magnetic sensingelement formed on the seed layer become too low for practical use.

The critical thickness depends on the composition and compositionalratio of the material constituting the seed layer. For example, when theseed layer is composed of a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy, the criticalthickness is 38 Å. As the Cr content in the NiFeCr alloy increases, thecritical thickness increases. As the Cr content decreases, the criticalthickness decreases.

In this embodiment of the present invention, the thickness of the seedlayer 22 composed of a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy can be set at avalue that is smaller than or equal to the critical thickness, i.e., 38Å, for example, at 20 Å.

In this embodiment, although the seed layer 22 has a thickness that issmaller than or equal to the critical thickness, i.e., 38 Å, the seedlayer 22 has a crystalline phase which extends through from the uppersurface to the lower surface of the seed layer 22, and moreover, theaverage crystal grain size, in a direction parallel to the layersurface, of the crystal grains in the seed layer 22 is larger than thethickness of the seed layer 22. Additionally, the average crystal grainsize of the seed layer 22 can be set at about 80 to 120 Å.

As will be shown in the experimental results described below, even ifthe seed layer 22 composed of a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy has athickness that is smaller than or equal to the critical thickness, i.e.,38 Å, a rate of change in resistance of 13% or more can be obtained, anda unidirectional exchange bias magnetic field Hex* of 16.0×10⁴ A/m ormore can also be obtained.

Herein, the unidirectional exchange bias magnetic field Hex* is definedas the magnitude of the external magnetic field when the rate of changein resistance ΔRs/Rs is half the maximum value.

The unidirectional exchange bias magnetic field Hex* includes theexchange coupling magnetic field generated between the pinned magneticlayer 3 and the antiferromagnetic layer 4 and the coupling magneticfield generated between the CoFe alloys constituting the pinned magneticlayer 3 having the laminated ferrimagnetic structure as a result of theRKKY interaction.

Consequently, when the pinned magnetic layer 3 does not have a laminatedferrimagnetic structure, the unidirectional exchange bias magnetic fieldHex* primarily means the exchange coupling magnetic field generatedbetween the pinned magnetic layer 3 and the antiferromagnetic layer 4.On the other hand, when the pinned magnetic layer 3 has the laminatedferrimagnetic structure shown in FIG. 1, the unidirectional exchangebias magnetic field Hex* primarily means the total of the exchangecoupling magnetic field and the coupling magnetic field as a result ofthe RKKY interaction.

As the unidirectional exchange bias magnetic field Hex* is increased,the pinned magnetic layer 3 can be more properly pinned in apredetermined direction. Even in the high-temperature atmosphere, themagnetization of the pinned magnetic layer 3 can be maintained in astrongly pinned state. Thereby, electromigration is prevented fromoccurring, and so-called current-carrying reliability can beappropriately improved.

The crystalline phase of the seed layer 22 has a face-centered cubic(fcc) structure, and the equivalent crystal plane represented as (111)plane is preferentially oriented parallel to the interface.

In the present invention, even if the Cr content in the NiCr alloy orNiFeCr alloy constituting the seed layer 22 is 40 to 60 atomic percent,the thickness of the seed layer 22 can be set at larger than 0 Å andsmaller than or equal to 38 Å.

Furthermore, even if the Cr content in the NiCr alloy or NiFeCr alloyconstituting the seed layer 22 is 35 to 60 atomic percent, the thicknessof the seed layer 22 can be set at larger than 0 Å and smaller than orequal to 30 Å. Preferably, the Cr content in the NiCr alloy or NiFeCralloy constituting the seed layer 22 is 50 atomic percent or less.

The thickness of the seed layer 22 is preferably 6 Å or more, and morepreferably 10 Å or more.

In the magnetic sensing element in this embodiment, even if the totalthickness and the shunt loss of the magnetic sensing element aredecreased by setting the thickness of the seed layer 22 to be smallerthan the critical thickness, a strong unidirectional exchange biasmagnetic field Hex* can be generated, and a large change in resistanceΔRs and a high rate of change in resistance ΔRs/Rs can be maintained.

The seed layer 22 is also applicable to other magnetic sensing elementswith different film structures.

FIG. 2 is a partial sectional view which shows a structure of a magneticsensing element (single spin-valve thin-film element) in a secondembodiment of the present invention, viewed from a surface facing arecording medium.

In the spin-valve thin-film element shown in FIG. 2, a pair of seedlayers 22 are disposed on an insulating layer 6 composed of alumina orthe like, the seed layers 22 being separated from each other with adistance corresponding to a track width Tw in the track width direction(in the X direction). Exchange bias layers 24 are disposed on the seedlayers 22.

The spaces between the seed layers 22 and between the exchange biaslayers 24 are filled with an insulating layer 17 composed of aninsulating material, such as SiO₂ or Al₂O₃.

A free magnetic layer 1 is disposed over the exchange bias layers 24 andthe insulating layer 17.

The exchange bias layer 24 is composed of the X—Mn alloy or the X—Mn—X′alloy, and the X content or the X+X′ content is preferably in the rangeof 45 to 60 atomic percent, and more preferably in the range of 49 to56.5 atomic percent.

In each side region of the free magnetic layer 1, the magnetization isaligned in a single-domain state in the X direction by the couplingmagnetic field generated between the exchange bias layer 24 and the freemagnetic layer 1. The magnetization of the central region of the freemagnetic layer 1 corresponding to the track width Tw is properly alignedin the X direction to so as to be rotated in response to an externalmagnetic field.

As shown in FIG. 2, a nonmagnetic layer 2 is disposed on the freemagnetic layer 1, and a pinned magnetic layer 3 is further disposed onthe nonmagnetic layer 2. An antiferromagnetic layer 4 and a protectivelayer 7 are disposed on the pinned magnetic layer 3.

In this embodiment, it is also possible to set the thickness of the seedlayer 22 composed of a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy to be smaller thanor equal to the critical thickness, i.e., 38 Å, for example, at 20 Å.

In this embodiment, although the seed layer 22 has a thickness that issmaller than or equal to the critical thickness, i.e., 38 Å, the seedlayer 22 also has a crystalline phase which extends through from theupper surface to the lower surface of the seed layer 22, and moreover,the average crystal grain size, in a direction parallel to the layersurface, of the crystal grains in the seed layer 22 is larger than thethickness of the seed layer 22. Additionally, the average crystal grainsize of the seed layer 22 can be set at about 80 to 120 Å.

In this embodiment, even if the total thickness and the shunt loss ofthe magnetic sensing element are decreased by setting the thickness ofthe seed layer 22 to be smaller than the critical thickness, a strongunidirectional exchange bias magnetic field Hex* can also be generated,and a large change in resistance ΔRs and a high rate of change inmagnetoresistance ΔRs/Rs can be maintained.

FIG. 3 is a partial sectional view which shows a dual spin-valvethin-film element in a third embodiment of the present invention.

As shown in FIG. 3, on an insulating layer 6 composed of alumina or thelike, a seed layer 22, a lower antiferromagnetic layer 4, a lower pinnedmagnetic layer 3, a lower nonmagnetic layer 2, and a free magnetic layer1 are continuously deposited. The free magnetic layer 1 has athree-layered structure including, for example, CoFe sublayers 10 and aNiFe layer 9. Furthermore, on the free magnetic layer 1, an uppernonmagnetic layer 2, an upper pinned Magnetic layer 3, and an upperantiferromagnetic layer 4, and a protective layer 7 are continuouslydeposited.

Hard bias layers 5 and electrode layers 8 are disposed at both sides ofthe laminated film including the insulating layer 6 to the protectivelayer 7. The individual layers are composed of the same materials asthose described with reference to FIG. 1.

In this embodiment, the seed layer 22 is disposed under the lowerantiferromagnetic layer 4 below the free magnetic layer 1. The X contentor the X+X′ content in the antiferromagnetic layer 4 is preferably inthe range of 45 to 50 atomic percent, and more preferably in the rangeof 49 to 56.5 atomic percent.

In this embodiment, it is also possible to set the thickness of the seedlayer 22 composed of a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy at a value that issmaller than or equal to the critical thickness, i.e., 38 Å, forexample, at 20 Å.

Although the seed layer 22 has a thickness that is smaller than or equalto the critical thickness, i.e., 38 Å, the seed layer 22 has acrystalline phase which extends through from the upper surface to thelower surface of the seed layer 22, and moreover, the average crystalgrain size, in a direction parallel to the layer surface, of the crystalgrains in the seed layer 22 is larger than the *thickness' of the seedlayer 22.

Even if the total thickness and the shunt loss of the magnetic sensingelement are decreased by setting the thickness of the seed layer 22 tobe smaller than the critical thickness, a strong unidirectional exchangebias magnetic field Hex* can be generated, and a large change inresistance ΔRs and a high rate of change in magnetoresistance ΔRs/Rs canbe maintained.

FIG. 4 is a partial sectional view of an anisotropic magnetoresistive(AMR) element in a fourth embodiment of the present invention, viewedfrom a surface facing a recording medium.

In the magnetoresistive element shown in FIG. 4, a pair of seed layers22 are disposed on an insulating layer 6 composed of alumina or thelike, the seed layers 22 being separated from each other with a distancecorresponding to a track width Tw in the track width direction (in theX′ direction). Exchange bias layers 21 are disposed on the seed layers22. The spaces between the seed layers 22 and between the exchange biaslayers 21 are filled with an insulating layer 26 composed of aninsulating material, such as SiO₂ or Al₂O₃.

A magnetoresistive layer (MR layer) 20, a nonmagnetic layer (shuntlayer) 19, and a soft magnetic layer (SAL layer) 18 are disposed overthe exchange bias layers 21 and the insulating layer 26.

In the AMR thin film element shown in FIG. 4, the regions E of themagnetoresistive layer 20 are put into a single-domain state in the Xdirection by the exchange coupling magnetic fields generated at theinterfaces between the magnetoresistive layer 20 and the exchange biaslayers 21. The magnetization of the region D of the magnetoresistivelayer 20 is aligned in the X direction by the influence of the Eregions. The magnetic field which is induced when a sensing currentflows in the magnetoresistive layer 20 is applied to the soft magneticlayer 18 in the Y direction. A transverse bias magnetic field is appliedto the region D of the magnetoresistive layer 20 in the Y direction bythe magnetostatic coupling-energy induced by the soft magnetic layer 18.Application of the transverse bias magnetic field to the region D of themagnetoresistive layer 20 which is put into the single-domain state inthe X direction results in linearity in the change in resistance inresponse to the change in the magnetic field of the region D of themagnetoresistive layer 20 (the magnetoresistive effect: the H-R effect).

A recording medium travels in the Z direction. When the leakage magneticfield is applied in the Y direction, the resistance in the region D ofthe magnetoresistive layer 20 is changed. This change is detected as achange in voltage.

In this embodiment, it is also possible to set the thickness of the seedlayer 22 composed of a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy at a value that issmaller than or equal to the critical thickness, i.e., 38 Å, forexample, at 20 Å.

Although the seed layer 22 has a thickness that is smaller than or equalto the critical thickness, i.e., 38 Å, the seed layer 22 has acrystalline phase which extends through from the upper surface to thelower surface of the seed layer 22, and moreover, the average crystalgrain size, in a direction parallel to the layer surface, of the crystalgrains in the seed layer 22 is larger than the thickness of the seedlayer 22. The average crystal grain size of the seed layer can be set atabout 80 to 120 Å.

Even if the total thickness and the shunt loss of the magnetic sensingelement are decreased by setting the thickness of the seed layer 22 tobe smaller than the critical thickness, a strong exchange couplingmagnetic field Hex can be generated, and a large change in resistanceΔRs and a high rate of change in magnetoresistance ΔRs/Rs can bemaintained.

FIG. 5 is a sectional view of a magnetic sensing element in a fifthembodiment of the present invention, viewed from a surface facing arecording medium.

In the magnetic sensing element shown in FIG. 5, a laminate T1 isdisposed on a lower gap layer 30 composed of an insulating material,such as alumina.

The laminate T1 includes a seed layer 31, a nonmagnetic metal layer 32,a pinned magnetic layer 33, a nonmagnetic layer 34, a free magneticlayer 35, and a protective layer 36 disposed in that order from thebottom.

The nonmagnetic metal layer 32 will be described later.

The pinned magnetic layer 33 has a synthetic ferrimagnetic structureincluding a first magnetic sublayer 33 a and a second magnetic sublayer33 c separated by a nonmagnetic intermediate sublayer 33 b. Themagnetization of the pinned magnetic layer 33 is pinned in the heightdirection (in the Y direction in the drawing) by the uniaxial magneticanisotropy of the pinned magnetic layer 33 itself.

The nonmagnetic layer 34 inhibits the pinned magnetic layer 33 and thefree magnetic layer 35 from being magnetically coupled to each other,and is preferably composed of a nonmagnetic material, such as Cu, Au, orPt. More preferably, the nonmagnetic layer 34 is composed of Cu. Thethickness of the nonmagnetic layer 34 is 17 to 30 Å.

The free magnetic layer 35 is composed of a magnetic material, such as aNiFe alloy or CoFe alloy. In the embodiment shown in FIG. 5, inparticular, when the free magnetic layer 35 is composed of a NiFe alloy,a diffusion-preventing layer (not shown in the drawing) composed of Coor CoFe is preferably disposed between the free magnetic layer 35 andthe nonmagnetic layer 34. The thickness of the free magnetic layer 35 is20 to 60 Å. The free magnetic layer 35 may have a syntheticferrimagnetic structure including a plurality of magnetic sublayers, thetwo adjacent magnetic sublayers being separated by a nonmagneticintermediate sublayer.

The protective layer 36 is composed of Ta or the like and prevents theoxidation of the laminate T1 from advancing. The thickness of theprotective layer 36 is 10 to 50 Å.

In this embodiment, bias underlayers 37, hard bias layers 38, andelectrode layers 39 are disposed at both sides of the laminate T1including the seed layer 31 to the protective layer 36. Themagnetization of the free magnetic layer 35 is aligned in the trackwidth direction (in the X direction in the drawing) by a longitudinalmagnetic field from the hard bias layers 35.

The bias underlayers 37 are composed of Cr, W, or Ti, and the hard biasunderlayers 38 is composed of, for example, a Co—Pt alloy or Co—Cr—Ptalloy. The electrode layers 39 are composed of Cr, Ta, Rh, Au, W, or thelike.

The thickness of the bias underlayer 37 is 20 to 100 Å. The thickness ofthe hard bias layer 38 is 100 to 400 Å. The thickness of the electrodelayer 39 is 400 to 1,500 Å.

An upper gap layer 40 composed of an insulating material, such asalumina, is disposed over the electrode layers 39 and the protectivelayer 36. Although not shown in the drawing, a lower shielding layer isdisposed under the lower gap layer 30, and an upper shielding layer isdisposed on the upper gap layer 40. Each of the lower shielding layerand the upper shielding layer is composed of a soft magnetic material,such as NiFe. The thickness of each of the upper gap layer 40 and thelower gap layer 30 is 50 to 300 Å.

The magnetization of the free magnetic layer 35 is aligned in the trackwidth direction (in the X direction in the drawing) by a longitudinalmagnetic field from the hard bias layers 38. The magnetization of thefree magnetic layer 35 is sensitively changed in response to a signalmagnetic field (external magnetic field) from the recording medium. Onthe other hand, the magnetization of the pinned magnetic layer 33 ispinned in the height direction (in the Y direction in the drawing).

The electrical resistance changes depending on the relationship betweenthe change in the magnetization direction of the free magnetic field 35and the pinned magnetization direction of the pinned magnetic layer 33(in particular, the pinned magnetization direction of the secondmagnetic sublayer 33 c). The leakage magnetic field from the recordingmedium is detected because of a change in voltage or current based onthe change in the electrical resistance.

The pinned magnetic layer 33 of the magnetic sensing element shown inFIG. 5 has a synthetic ferrimagnetic structure including the firstmagnetic sublayer 33 a and the second magnetic sublayer 33 c separatedby the nonmagnetic intermediate sublayer 33 b. The first magneticsublayer 33 a and the second magnetic sublayer 33 c are magnetizedantiparallel to each other due to the RKKY interaction via thenonmagnetic intermediate sublayer 33 b.

The first magnetic sublayer 33 a is placed further away from thenonmagnetic layer 34 compared to the second magnetic sublayer 33 c, andis in contact with the nonmagnetic metal layer 32.

The nonmagnetic metal layer 32 is composed of a PtMn alloy or X—Mnalloy, wherein X is at least one element selected from the groupconsisting of Pt, Pd, Ir, Rh, Ru, Os, Ni, and Fe.

The thickness of the nonmagnetic metal layer 32 is preferably 5 to 50 Å.If the nonmagnetic metal layer 32 composed of the PtMn alloy or X—Mnalloy, wherein X is at least one element selected from the groupconsisting of Pt, Pd, Ir, Rh, Ru, Os, Ni, and Fe, has a thickness in therange described above, the nonmagnetic metal layer 32 maintains theface-centered cubic (fcc) crystal structure which is the stateas-deposited. If the thickness of the nonmagnetic metal layer 32 islarger than 50 Å and smaller than 80 Å, the crystal structure istransformed into a CuAuI-type ordered face-centered tetragonal (fct)structure when annealed at 250° C. or more, and thus antiferromagnetismis exhibited. This is not advantageous because heat resistance isdegraded. However, even if the thickness of the nonmagnetic metal layer32 is larger than 50 Å, if a heat of 250° C. or more is not applied, thenonmagnetic metal layer 32 maintains the face-centered cubic (fcc)crystal structure which is the state as-deposited.

When the nonmagnetic metal layer 32 composed of the PtMn alloy or X—Mnalloy, wherein X is at least one element selected from the groupconsisting of Pt, Pd, Ir, Rh, Ru, Os, Ni, and Fe, has the face-centeredcubic (fcc) crystal structure, an exchange coupling magnetic field isnot generated at the interface between the nonmagnetic metal layer 32and the first magnetic sublayer 33 a, or the exchange coupling magneticfield is extremely weak even if generated. Thereby, it is not possibleto pin the magnetization of the first magnetic sublayer 33 a by theexchange coupling magnetic field.

Consequently, in the magnetic sensing element shown in FIG. 5, themagnetization of the pinned magnetic layer 33 is pinned by the uniaxialmagnetic anisotropy of the pinned magnetic layer 33 itself. Such amagnetic sensing element is referred to as a self-pinned magneticsensing element.

In the self-pinned magnetic sensing element, the shunt loss can bedecreased compared with the magnetic sensing element including a thickantiferromagnetic layer with a thickness of about 200 Å. Therefore, themagnetic field detection output of the magnetic sensing element can beimproved by 20% to 30%. Furthermore, since the distance between theupper and lower shielding layers in the magnetic sensing element can bedecreased, such a magnetic sensing element can also meet furtherincreases in linear recording density of recording media.

In this embodiment, the thickness of the second magnetic sublayer 33 cis larger than the thickness of the first magnetic sublayer 33 a. Themagnetization of the second magnetic sublayer 33 c is directed in theheight direction (in the Y direction), and the magnetization of thefirst magnetic sublayer 33 a is pinned antiparallel to the heightdirection.

The thickness of the first magnetic sublayer 33 a is 10 to 30 Å, and thethickness of the second magnetic sublayer 33 c is 15 to 35 Å. As thethickness of the first magnetic sublayer 33 a increases, the coerciveforce increases. However, if the thickness of the first magneticsublayer 33 a increases, the shunt loss increases. As will be describedbelow, when the first magnetic layer 33 a is aligned with thenonmagnetic metal layer 32, strain occurs in the crystal structure, andthis strain increases the magnetostriction constant X and the uniaxialmagnetic anisotropy.

The uniaxial magnetic anisotropy which pins the magnetization of thepinned magnetic layer 33 depends on induced magnetic anisotropy andmagnetoelastic effect. The present invention mainly uses themagnetoelastic effect.

The magnetoelastic effect is controlled by magnetoelastic energy. Themagnetoelastic energy is defined by the stress a applied to the pinnedmagnetic layer 33 and the magnetostriction constant X of the pinnedmagnetic layer 33.

FIG. 6 is a plan view of the magnetic sensing element shown in FIG. 5,viewed from above (from a direction opposite to the Z direction in thedrawing). The laminate T1 of the magnetic sensing element is disposedbetween the pairs of bias underlayers 37, hard bias layers 38, andelectrode layers 39. Since the bias underlayers 37 and the hard biaslayers 38 are disposed under the electrode layers 39, they are not shownin FIG. 6. The periphery of the laminate T1, the bias underlayers 37,the hard bias layers 38, and the electrode layers 39 are filled with aninsulating layer 41 indicated by oblique lines in FIG. 6.

An end face F, which faces the recording medium, of the laminate T1, thebias underlayers 37, the hard bias layers 38, and the electrode layers39 is either exposed or simply covered with a thin protective layercomposed of diamond-like carbon (DLC) or the like with a thickness of 20to 50 That is, the end face F is an open end.

Consequently, since the originally two-dimensionally isotropic stressesfrom the lower gap layer 30 and the upper gap layer 40 are released atthe end face F, the symmetry is lost, and as a result, tensile stressesare applied parallel to the height direction (the Y direction). When thelaminate including the bias underlayers 37, the hard bias layers 38, andthe electrode layers 39 has compressive internal stresses, since theelectrode layers 39, etc., are apt to stretch in the in-plane direction,compressive stresses are applied to the laminate T1 in directionsparallel and antiparallel to the track width direction (the Xdirection).

That is, the tensile stresses in the height direction and thecompressive stresses in the track width direction are applied to thepinned magnetic layer 33 which is opened at the end face F facing therecording medium. Since the first magnetic sublayer 33 a is composed ofa magnetic material having a positive magnetostriction constant, theeasy magnetization axis of the first magnetic sublayer 33 a is directedtoward the back, i.e., parallel to the height direction (the Ydirection), and the magnetization of the first magnetic sublayer 33 a ispinned parallel or antiparallel to the height direction. Themagnetization of the second magnetic sublayer 33 c is pinnedantiparallel to the magnetization direction of the first magneticsublayer 33 a by the RKKY interaction via the nonmagnetic intermediatesublayer 33 b.

In the present invention, by increasing the magnetostriction constant ofthe pinned magnetic layer 33, the magnetoelastic energy is increased,and thereby the uniaxial magnetic anisotropy of the pinned magneticlayer 33 is increased. If the uniaxial magnetic anisotropy of the pinnedmagnetic layer 33 is increased, the magnetization of the pinned magneticlayer 33 is strongly pinned in a certain direction, resulting in anincrease in the output of the magnetic sensing element and improvementsin stability in the output and symmetry.

Specifically, by joining the first magnetic sublayer 33 a constitutingthe pinned magnetic layer 33 with the nonmagnetic metal layer 32, strainis caused in the crystal structure of the first magnetic sublayer 33 aso that the magnetostriction constant X of the first magnetic sublayer 3a is increased.

As described above, the nonmagnetic metal layer 32 has the fcc structureand the equivalent crystal plane represented as {111} plane ispreferentially oriented parallel to the interface.

On the other hand, when the first magnetic sublayer 33 a of the pinnedmagnetic layer 33 is composed of Co or Co_(x)Fe_(y), wherein y<20, andx+Y=100, the first magnetic sublayer 33 a has a face-centered cubic(fcc) structure. In the first magnetic sublayer 33 a, the equivalentcrystal plane represented as {111} plane is preferentially orientedparallel to the interface.

Consequently, the atoms constituting the first magnetic sublayer 33 aand the atoms constituting the nonmagnetic metal layer 32 are easilymatched with each other, and the crystals in the nonmagnetic metal layer32 and the crystals in the dinned magnetic layer 33 are in the epitaxialstate.

However, there must be a certain difference or more Between the nearestatom spacing in the {111} plane of the first magnetic sublayer 33 a andthe nearest atom spacing in the {111} plane of the nonmagnetic metallayer 32.

In order to increase the magnetostriction of the first magnetic sublayer33 a by causing strain in the crystal structure while allowing the atomsconstituting the nonmagnetic metal layer 32 and the atoms constitutingthe first magnetic sublayer 33 a to be substantially matched with eachother, preferably, the Pt content in the PtMn alloy or the X content inthe X—Mn alloy which constitutes the nonmagnetic metal layer 32 isadjusted.

For example, if the Pt content in the PtMn alloy or the X content in theX—Mn alloy is set at 51 atomic percent or more, the magnetostriction ofthe first magnetic sublayer 33 a which overlies the nonmagnetic metallayer 32 is rapidly increased. Alternatively, if the X content in theX—Mn alloy is set in the range of 55 to 99 atomic percent, themagnetostriction of the first magnetic sublayer 33 a becomes stable at alarge value.

Preferably, the value obtained by dividing the difference between thenearest atom spacing in the {111} plane of the nonmagnetic metal layer32 and the nearest atom spacing in the {111} plane of the first magneticsublayer 33 a by the nearest atom spacing in the {111} plane of thefirst magnetic sublayer 33 a (hereinafter referred to as the mismatchvalue) is set at 0.05 to 0.20.

In the magnetic sensing element in this embodiment, while the atomsconstituting the nonmagnetic metal layer 32 and the atoms constitutingthe first magnetic sublayer 33 a are substantially matched with eachother, strain occurs in the crystal structures in the vicinity of theinterface.

Alternatively, the first magnetic sublayer 33 a of the pinned magneticlayer 33 may have a body-centered cubic (bcc) structure and theequivalent crystal plane represented as {110} plane is preferentiallyoriented parallel to the interface.

For example, when the first magnetic sublayer 33 a of the pinnedmagnetic layer 33 is composed of Co_(x)Fe_(y), wherein y>20, andx+y=100, the first magnetic sublayer 33 a has a body-centered cubic(bcc) structure.

As described above, the nonmagnetic metal layer 32 has the fcc structureand the equivalent crystal plane represented as {111} plane ispreferentially oriented parallel to the interface.

The atomic arrangement in the equivalent crystal plane represented as{110} plane of crystals having the bcc structure is similar to theatomic arrangement in the equivalent crystal plane represented as {111}plane of crystals having the fcc structure. It is possible to arrangethe crystals having the bcc structure and the crystals having the fccstructure so as to have a coherent state in which the individual atomsare matched with each other, i.e., a so-called heteroepitaxial state.

Furthermore, there is a certain difference or more between the nearestatom spacing in the {110} plane of the first magnetic sublayer 33 a andthe nearest atom spacing in the {111} plane of the nonmagnetic metallayer 32. Therefore, in the vicinity of the interface between the firstmagnetic sublayer 33 a and the nonmagnetic metal layer 32, while theatoms constituting the first magnetic sublayer 33 a and the atomsconstituting the nonmagnetic metal layer 32 are substantially matchedwith each other, strain occurs in the individual crystal structures.Consequently, by causing the strain in the crystal structure of thefirst magnetic sublayer 33 a, the magnetostriction constant λ can beincreased.

Additionally, the Co_(x)Fe_(y) alloy, wherein y≧20, and x+y=100, havingthe bcc structure has a larger magnetostriction constant X than theCo_(x)Fe_(y) alloy, wherein y≦20, and x+Y=100, having the fcc structure.Therefore, a larger magnetoelastic effect can be exhibited. Furthermore,the Co_(x)Fe_(y) alloy, wherein y≧20, and x+y=100, having the bccstructure has a large coercive force, and thereby the magnetization ofthe pinned magnetic layer 33 can be strongly pinned.

In the present invention, at the vicinity of the interface between thefirst magnetic sublayer 33 a and the nonmagnetic metal layer 32, most ofthe atoms constituting the first magnetic sublayer 33 a and most of theatoms constituting the nonmagnetic metal layer 32 must be matched witheach other, i.e. in the coherent state. For example, there may beregions in which the atoms constituting the first pinned magneticsublayer 33 a and the atoms constituting the nonmagnetic metal layer 32are not matched with each other.

As the material for the second pinned magnetic sublayer 33 c, either theCo_(x)Fe_(y) alloy, wherein y≧20, and x+y=100, having the bcc structureor the Co_(x)Fe_(y) alloy, wherein y≦20, and x+Y=100, having the fccstructure may be used.

If the Co_(x)Fe_(y) alloy, wherein y≧20, and x+y=100, having the bccstructure is used for the second magnetic sublayer 33 c, the positivemagnetostriction can be increased. Furthermore, the Co_(x)Fe_(y) alloy,wherein y≧20, and x+y=100, having the bcc structure has a large coerciveforce, and thereby the magnetization of the pinned magnetic layer 33 canbe pinned strongly. The RKKY interaction between the first magneticsublayer 33 a and the second magnetic sublayer 33 c via the nonmagneticintermediate sublayer 33 b can also be increased.

On the other hand, since the second magnetic sublayer 33 c, which is incontact with the nonmagnetic layer 34, greatly affects themagnetoresistance effect, if the second magnetic sublayer 33 c iscomposed of Co or Co_(x)Fe_(y), wherein y≦20, and x+Y=100, having thefcc structure, a degradation in the magnetoresistance effect isdecreased.

The seed layer 31 is used in order to improve the {111} orientation ofthe nonmagnetic metal layer 32.

In this embodiment, it is also possible to set the thickness of the seedlayer 31 composed of a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy so as to besmaller than or equal to the critical thickness, i.e., 38 Å, forexample, at 20 Å.

Although the seed layer 31 has a thickness that is smaller than or equalto the critical thickness, i.e., 38 Å, the seed layer 31 has acrystalline phase which extends through from the upper surface to thelower surface of the seed layer 31, and moreover, the average crystalgrain size, in a direction parallel to the layer surface, of the crystalgrains in the seed layer 31 is larger than the thickness of the seedlayer 31. The average crystal grain size of the seed layer can be set atabout 80 to 120 Å.

Even if the total thickness and the shunt loss of the magnetic sensingelement are decreased by setting the thickness of the seed layer 31 soas to be smaller than the critical thickness, the uniaxial magneticanisotropy based on the magnetoelastic effect of the pinned magneticlayer 33 is increased, and the magnetization of the pinned magneticlayer 33 is strongly pinned in a predetermined direction. Thereby, alarger change in resistance ΔRs and a higher rate of change inresistance ΔRs/Rs can be maintained.

The magnetic sensing element of the present invention described abovecan be fabricated by the method described below.

First, a seed layer 22 is formed at a thickness that is larger than thecritical thickness of the seed layer 22. Next, by etching the uppersurface of the seed layer 22, the seed layer 22 with a thickness that issmaller than or equal to the critical thickness is formed.

In the step of etching the upper surface of the seed layer 22, plasmaetching (inverse sputtering), reactive ion etching, or ion beam etchingmay be used. In the ion beam etching process, the layer surface can beprocessed more smoothly compared with the other processes and superiorreproducibility can be achieved.

When the seed layer 22 is composed of the (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀alloy, the critical thickness is 38 Å. For example, after the seed layer22 is formed at a thickness of 42 Å, the thickness is decreased to 22 Åby etching the upper surface of the seed layer 22.

Furthermore, an antiferromagnetic layer, a pinned magnetic layer, anonmagnetic layer, and a free magnetic layer are deposited on the seedlayer 22.

By forming the seed layer 22 at a thickness that is larger than thecritical thickness first, it is possible to form a crystalline phaseincluding crystal grains which extend through from the upper surface tothe lower surface of the seed layer 22. Once the crystalline phaseincluding the crystal grains which extend through from the upper surfaceto the lower surface of the seed layer 22 is formed, even if the seedlayer 22 is etched so that the thickness is smaller than or equal to thecritical thickness, the shape of the columnar grains which extendthrough from the upper surface to the lower surface is maintained.

Furthermore, if the seed layer 22 is formed at a thickness that islarger than the critical thickness, the crystal grain size of thecrystals formed in the seed layer 22 is sufficiently increased. Afterthe formation, even if the seed layer 22 is etched to decrease thethickness to be equal to or smaller than the critical thickness, thecrystal grain size of the crystals formed in the seed layer 22 ismaintained.

Consequently, by using the method for fabricating the exchange-coupledfilm of the present invention, even if the thickness of the seed layer22 is set to be smaller than the critical thickness, the average crystalgrain size, in a direction parallel to the layer surface, of the crystalgains in the seed layer 22 can be set to be larger than the thickness ofthe seed layer 22, i.e., 22 Å.

Therefore, by using the fabrication method of the present invention,even if the thickness of the seed layer 22 is set to be smaller than thecritical thickness, it is possible to generate a strong exchangecoupling magnetic field Hex at the interface between theantiferromagnetic layer and the pinned magnetic layer.

Additionally, the seed layer 22 has a face-centered cubic (fcc)structure and a crystalline phase in which the equivalent crystal planerepresented as {111} plane is preferentially oriented parallel to theinterface.

If the seed layer 22 or 31 is composed of a NiCr alloy or NiFeCr alloywith a Cr content of 40 to 60 atomic percent, the critical thicknessbecomes larger than 38 Å. In the present invention, it is possible toset the thickness of the seed layer 22 or 31 to be smaller than or equalto the critical thickness by etching the seed layer 22 or 31 so that thethickness thereof is larger than 0 Å and smaller than or equal to 38 Å.

Furthermore, if the seed layer 22 or 31 is composed of a NiCr alloy orNiFeCr alloy with a Cr content of 35 to 60 atomic percent, the criticalthickness becomes larger than 30 Å. In the present invention, it ispossible to set the thickness of the seed layer 22 or 31 to be smallerthan or equal to the critical thickness by etching the seed layer 22 or31 so that the thickness thereof is larger than 0 Å and smaller than orequal to 30 Å.

The thickness of the seed layer 22 is preferably 6 Å or more, and morepreferably 12 Å or more.

Additionally, if the Cr content in the NiCr alloy or NiFeCr alloy isincreased, the critical thickness increases, end the initial thicknessof the film must be increased. Therefore, the Cr content in the NiCralloy or NiFeCr alloy is preferably 50 atomic percent or less.

FIG. 7 is a transmission electron micrograph of a magnetic sensingelement of the present invention including an antiferromagnetic layer 4(PtMn)/pinned magnetic layer 3 (CoFe/Ru/CoFe)/nonmagnetic layer 2(Cu)/free magnetic layer 1 (CoFe/NiFe)/protective layer 7 (Ta (30 Å))deposited on a seed layer 22 (NiFeCr). FIG. 8 is a schematic diagram ofthe transmission electron micrograph shown in FIG. 7.

Herein, the seed layer 22 is composed of a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀alloy. After the seed layer 22 is formed at a thickness of 42 Å, thesurface of the seed layer is etched so that the thickness is 22 Å.Inverse sputtering, plasma etching, ion beam etching, or reactive ionetching may be used to etch the seed layer 22.

Furthermore, the antiferromagnetic layer 4, the pinned magnetic layer 3,the nonmagnetic layer 2, the free magnetic layer 1, and the protectivelayer 7 are continuously formed on the seed layer 22 by sputtering. Asshown in FIG. 7, the seed layer 22 has a crystalline phase includingcolumnar grains 50 which extend through from an upper surface 22 a to alower surface 22 b.

The average crystal grain size, in a direction parallel to the layersurface, of the crystal grains in the seed layer 22 is 113 Å, which islarger than the thickness t1 of the seed layer 22, i.e., 22 Å.

The crystalline phase (columnar grains 50) of the seed layer 22 has aface-centered cubic (fcc) structure and the equivalent crystal planerepresented as {111} plane is preferentially oriented parallel to thelayer surface.

In each of the pinned magnetic layer 3, the nonmagnetic layer 2, and thefree magnetic layer 1, the equivalent crystal plane represented as {111}plane is also preferentially oriented parallel to the layer surface.

In this embodiment, although the thickness of the seed layer is smallerthan or equal to the critical thickness (38 Å), it is possible to alignthe crystal orientations of the antiferromagnetic layer, the pinnedmagnetic layer, the nonmagnetic layer, and the free magnetic layer.Furthermore, since it is possible to decrease the shunt of the sensingcurrent, the rate of change in resistance ΔR/R can be improved.

For comparison, a transmission electron micrograph of a magnetic sensingelement is shown in each of FIGS. 9 and 10. The magnetic sensing elementincludes antiferromagnetic layer (PtMn)/pinned magnetic layer(CoFe/Ru/CoFe)/nonmagnetic layer (Cu)/free magnetic layer(CoFe/NiFe)/protective layer (Ta (30 Å)) deposited on a conventionalseed layer (NiFeCr). FIG. 11 is a schematic diagram of the transmissionelectron micrograph of FIG. 9, and FIG. 12 is a schematic diagram of thetransmission electron micrograph of FIG. 10.

In the magnetic sensing element shown in FIG. 11, after a seed layer 62is formed using a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy by sputtering at athickness t2, an antiferromagnetic layer 63, a pinned magnetic layer 64,a nonmagnetic layer 65, a free magnetic layer 66, and a protective layer67 were continuously deposited.

As shown in FIG. 11, since the seed layer 62 (NiFeCr) is formed at athickness that is larger than the critical thickness, i.e., 38 Å, theseed layer 62 has a crystalline phase including columnar grains 60 whichextend through from an upper surface 62 a to a lower surface 62 b.

The crystalline phase (columnar grains 60) of the seed layer 62 has aface-centered cubic (fcc) structure and the equivalent crystal planerepresented as {111} plane is preferentially oriented parallel to thelayer surface.

In each of the pinned magnetic layer 64, the nonmagnetic layer 65, andthe free magnetic layer 66, the equivalent crystal plane represented as{111} plane is also preferentially oriented parallel to the layersurface.

In the magnetic sensing element shown in FIG. 12, after a seed layer 72is formed using a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy by sputtering at athickness t3 of 32 Å, an antiferromagnetic layer 73, a pinned magneticlayer 74, a nonmagnetic layer 75, a free magnetic layer 76, and aprotective layer 77 were continuously deposited.

Since the seed layer 72 (NiFeCr) is formed at a thickness that issmaller than the critical thickness, i.e., 38 Å, the crystal grain sizeof the crystal grains generated in the seed layer 72 is small, andcolumnar grains which extend through from an upper surface 72 a to alower surface 72 b are not formed in the crystalline phase of the seedlayer 72.

The average crystal grain size, in a direction parallel to the layersurface, of the crystal grains 70 in the seed layer 72 is 20 Å which issmaller than the thickness t3 of the seed layer 72, i.e., 32 Å.

In each of the pinned magnetic layer 74, the nonmagnetic layer 75, andthe free magnetic layer 76, the equivalent crystal plane represented as{111} plane is not oriented in a certain direction.

In the laminate constituting the magnetic sensing element shown in FIG.12, the unidirectional exchange bias magnetic field Hex* is small atabout 8.8×10⁴ A/m, and the rate of change in magnetoresistance ΔRs/Rs is8% or less. The laminate shown in FIG. 12 thus has inferior performancecompared to the laminate constituting the magnetic sensing element ofthe present invention.

Additionally, as in the present invention, when the surface of the seedlayer 22 is etched, the Cr concentration at the outermost surface of thefinished seed layer 22 may be slightly lower than the Cr concentrationinside the seed layer 22 and the Ni concentration at the outermostsurface of the finished seed layer 22 may be slightly higher than the Niconcentration inside the seed layer 22. If such a concentration gradientoccurs, it is believed that the surface energy of the seed layer 22changes and the surface of the seed layer 22 improves, resulting in anincrease in the exchange coupling magnetic field Hex between theantiferromagnetic layer 4 and the pinned magnetic layer 3. Thisconcentration gradient is caused by the step of etching the surface ofthe seed layer 22 and does not occur in the conventional seed layer.

EXAMPLES

Magnetic sensing elements were fabricated for testing. In order tofabricate each magnetic sensing element, a seed layer was formed using a(Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy at a thickness of 42 Å by sputtering, andthe upper surface of the seed layer was etched so that the thickness ofthe seed layer was smaller than or equal to the critical thickness,i.e., 38 Å. Plasma etching (inverse sputtering) or ion beam etching wasused to etch the seed layer. Furthermore, a structure ofantiferromagnetic layer [PtMn (140 Å)]/pinned magnetic layer [CoFe (16Å)/Ru (8.7 Å)/CoFe (22 Å)]/nonmagnetic layer [Cu (19 Å)]/free magneticlayer [CoFe (10 Å)/NiFe (35 Å)]/protective layer (Ta (30 Å)] wascontinuously formed by sputtering on the seed layer.

By changing the amount removed from the seed layer, magnetic sensingelements having seed layers with different thicknesses were prepared.The rate of change in resistance ΔRs/Rs, the change in resistance ΔRs,the sheet resistance ΔRs, and the unidirectional exchange bias magneticfield Hex* were measured.

The results thereof are shown by delta (A) in the graphs of FIGS. 13 to16. FIG. 13 is a graph which shows the measurement results of the rateof change in resistance ΔRs/Rs. FIG. 14 is a graph which shows themeasurement results of the change in resistance ΔRs. FIG. 15 is a graphwhich shows the measurement results of the sheet resistance Rs. FIG. 16is a graph which shows the measurement results of the unidirectionalexchange bias magnetic field Hex*.

For comparison, the graphs of FIGS. 28 to 31, which have been describedabove with reference to the conventional magnetic sensing elements, arealso shown by dotted lines in FIGS. 13 to 16, respectively.

When the seed layer composed of the (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy isfirst formed by sputtering at 42 Å, which is larger than the criticalthickness of 38 Å, and then the surface of the seed layer is etched sothat the thickness is smaller than or equal to the critical thickness inaccordance with the present invention, as shown in FIG. 13, as thethickness (finished thickness) of the seed layer after the etching stepdecreases, the rate of change in resistance ΔRs/Rs increases.

As shown in FIG. 13, even if the finished thickness of the seed layer issmaller than or equal to the critical thickness of 38 Å, a rate ofchange in resistance ΔRs/Rs of 14% or more can be achieved. Inparticular, when the finished thickness of the seed layer is in a rangeof 9 to 22 Å, a rate of change in resistance ΔRs/Rs of 15% or more canbe achieved.

The rate of change in resistance ΔRs/Rs increases as the finishedthickness of the seed layer decreases because it is believed that theshunt loss due to the flow of the sensing current into the seed layerdecreases.

If the finished thickness of the seed layer becomes smaller than 12 Å,the rate of change in resistance ΔRs/Rs gradually decreases. However, ifthe finished thickness of the seed layer is 3 Å or more, a rate ofchange in resistance ΔRs/Rs of 14% or more can be achieved.

As shown in FIG. 14, when the seed layer composed of the(Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy is first formed by sputtering at 42 Åwhich is larger than the critical thickness of 38 Å, and then thesurface of the seed layer is etched so that the thickness is smallerthan or equal to the critical thickness, as the thickness (finishedthickness) of the seed layer after the etching step decreases, thechange in resistance ΔRs increases.

As is evident from FIG. 14, when the finished thickness of the seedlayer is 42 Å, the change in resistance ΔRs is 2.55 ohms per square.When the finished thickness of the seed layer is 22 Å, the change inresistance ΔRs is 2.83 ohms per square. When the finished thickness ofthe seed layer is 6 Å, the change in resistance ΔRs is 2.94 ohms persquare. When the finished thickness of the seed layer is 3 Å, the changein resistance ΔRs is 2.95 ohms per square.

As shown by doffed line in FIG. 15, in the magnetic sensing elementincluding the conventional seed layer which has the finished thicknessbeing equal to the thickness as deposited, when the thickness of theseed layer becomes equal to or smaller than the critical thickness of 38Å, the sheet resistance Rs of the magnetic sensing element rapidlyincreases.

On the other hand, when the seed layer composed of the(Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy is first formed by sputtering at 42 Åwhich is larger than the critical thickness of 38 Å, and then thesurface of the seed layer is etched so that the thickness is smallerthan or equal to the critical thickness, the sheet resistance Rs doesnot rapidly increase even if the finished thickness is smaller than orequal to the critical thickness of 38 Å.

As is evident from FIG. 15, when the finished thickness of the seedlayer is 32 Å, the sheet resistance Rs is 18.3 ohms per square. Evenwhen the finished thickness of the seed layer is 12 Å, the sheetresistance Rs is 19.2 ohms per square, which is an increase of onlyabout 1 ohm per square. Even when the finished thickness of the seedlayer is 3 Å, the sheet resistance Rs is 20.6 ohms per square.

In the magnetic sensing element including the conventional seed layerwith the finished thickness being equal to the thickness as deposited,when the thickness of the seed layer becomes equal to or smaller than 38Å, the unidirectional exchange bias magnetic field Hex* of the magneticsensing element rapidly decreases.

On the other hand, when the seed layer composed of the(Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy is first formed by sputtering at 42 Å,which is larger than the critical thickness of 38 Å, and then thesurface of the seed layer is etched so that the thickness is smallerthan or equal to the critical thickness, the unidirectional exchangebias magnetic field Hex* does not rapidly decrease even if the finishedthickness is smaller than the critical thickness of 38 Å.

As is evident from FIG. 16, even if the finished thickness of the seedlayer is equal to or smaller than the critical thickness of 38 Å orless, if the finished thickness of the seed layer is 12 Å or more, aunidirectional exchange bias magnetic field Hex* of 160 kA/m or more isexhibited. When the finished thickness of the seed layer is 9 Å, theunidirectional exchange bias magnetic field Hex* has the minimum value,which is 158 kA/m (1,972 Oe).

Next, the other magnetic sensing elements were fabricated for testing.In order to fabricate each magnetic sensing element, a seed layer wasformed using a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy at a thickness of 42 Å bysputtering, and the upper surface of the seed layer was etched so thatthe thickness of the seed layer was smaller than or equal to thecritical thickness, i.e., 38 Å. Plasma etching or ion beam etching wasused to etch the seed layer. Furthermore, a structure of nonmagneticmetal layer [PtMn (30 Å)]/pinned magnetic layer [CoFe (17 Å)/Ru (8.7Å)/Co (22 Å)]/nonmagnetic layer [Cu (19 Å)]/free magnetic layer [CoFe(10 Å)/NiFe (35 Å)]/protective layer [Ta (30 Å)] was continuously formedby sputtering on the seed layer. This magnetic sensing elementcorresponds to the self-pinned magnetic sensing element shown in FIG. 5.

By changing the amount removed from the seed layer, magnetic sensingelements having seed layers with different thicknesses were prepared.The rate of change in resistance ΔRs/Rs, the change in resistance ΔRs,and the sheet resistance Rs were measured.

The results thereof are shown by square (□) in the graphs of FIGS. 13 to15. FIG. 13 is a graph which shows the measurement results of the rateof change in resistance ΔRs/Rs. FIG. 14 is a graph which shows themeasurement results of the change in resistance ΔRs. FIG. 15 is a graphwhich shows the measurement results of the sheet resistance Rs.

When the seed layer composed of the (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy isfirst formed by sputtering at 42 Å, which is larger than the criticalthickness of 38 Å, and then the surface of the seed layer is etched sothat the thickness is smaller than or equal to the critical thickness inaccordance with the present invention, as shown in FIG. 13, as thethickness (finished thickness) of the seed layer after the etching stepdecreases, the rate of change in resistance ΔRs/Rs increases.

As shown in FIG. 13, even if the finished thickness of the seed layer issmaller than or equal to the critical thickness of 38 Å, a rate ofchange in resistance ΔRs/Rs of 15% or more can be achieved when thefinished thickness of the seed layer is 12 Å or more.

The rate of change in resistance ΔRs/Rs increases as the finishedthickness of the seed layer decreases because it is believed that theshunt loss due to the flow of the sensing current into the seed layerdecreases.

If the finished thickness of the seed layer becomes smaller than 12 Å,the rate of change in resistance ΔRs/Rs rapidly decreases. If thefinished thickness of the seed layer is 9 Å or more, a rate of change inresistance ΔRs/Rs of 11.3 or more can be obtained. When the finishedthickness of the seed layer is 6 Å, the rate of change in resistanceΔRs/Rs is 3.97. When the finished thickness of the seed layer is 3 Å,the rate of change in resistance ΔRs/Rs is 3.49%.

As shown in FIG. 14, when the seed layer composed of the(Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy is first formed by sputtering at 42 Å,which is larger than the critical thickness of 38 Å, and then thesurface of the seed layer is etched so that the thickness is smallerthan or equal to the critical thickness, as the thickness (finishedthickness) of the seed layer after the etching step decreases, thechange in resistance ΔRs increases.

As is evident from FIG. 14, when the finished thickness of the seedlayer is 32 Å, the change in resistance ΔRs is 2.78 ohms per square.When the finished thickness of the seed layer is 12 Å, the change inresistance ΔRs is 2.90 ohms per square. If the finished thickness of theseed layer becomes smaller than 12 Å, the change in resistance ΔRsrapidly decreases. If the finished thickness of the seed layer is 9 Å ormore, a change in resistance ΔRs of 2.18 ohms per square can beobtained. When the finished thickness of the seed layer is 6 Å, thechange in resistance ΔRs is 0.78 ohms per square. When the finishedthickness of the seed layer is 3 Å, the change in resistance ΔRs is 0.71ohms per square.

When the seed layer composed of the (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy isfirst formed by sputtering at 42 Å, which is larger than the criticalthickness of 38 Å, and then the surface of the seed layer is etched sothat the thickness is smaller than or equal to the critical thickness,even if the finished thickness is equal to or smaller than the criticalthickness of 38 Å, the change in resistance ΔRs does not rapidlyincrease.

As is evident from FIG. 15, when the finished thickness of the seedlayer is 32 Å, the sheet resistance Rs is 17.54 ohms per square. Evenwhen the finished thickness of the seed layer is 12 Å, the sheetresistance Rs is 18.75 ohms per square, which is an increase of onlyabout 1 ohm per square. Even when the finished thickness of the seedlayer is 3 Å, the sheet resistance Rs is 20.33 ohms per square.

Next, the crystal structures of laminates including seed layersconstituting magnetic sensing elements of the present invention wereinvestigated by X-ray diffraction.

In order to fabricate each magnetic sensing element, a seed layer wasformed using a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy at a thickness of 42 Å bysputtering, and the upper surface of the seed layer was etched so thatthe thickness of the seed layer was smaller than or equal to thecritical thickness, i.e., 38 Å. Plasma etching (inverse sputtering) orion beam etching was used to etch the seed layer. Furthermore, astructure of antiferromagnetic layer (PtMn)/pinned magnetic layer(CoFe/Ru/CoFe)/nonmagnetic layer (Cu)/free magnetic layer(CoFe/NiFe)/protective layer (Ta) was continuously formed by Sputteringon the seed layer.

By changing the amount removed from the seed layer, Laminates havingseed layers with different thicknesses were prepared. Each laminate wasannealed at 290° C. for 3 hours in a vacuum magnetic field of 8×10⁵ A/mto transform the disordered lattice of the antiferromagnetic layer intothe ordered lattice. The resultant magnetic sensing element was analyzedby X-ray diffraction, and the rocking curve of the antiferromagneticlayer (PtMn) and the rocking curve of the seed layer, the pinnedmagnetic layer (CoFe/Ru/CoFe), the nonmagnetic layer (Cu), and the freemagnetic layer (CoFe/NiFe) were obtained.

As comparative examples, magnetic sensing elements were also prepared.In order to fabricate each magnetic sensing element, a seed layer wasformed using a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy at a thickness of 42 Å or32 Å by sputtering, and without etching the upper surface of the seedlayer, a structure of antiferromagnetic layer (PtMn)/pinned magneticlayer (CoFe/Ru/CoFe)/nonmagnetic layer (Cu)/free magnetic layer(CoFe/NiFe)/protective layer (Ta) was continuously formed by sputteringon the seed layer. An annealing treatment was then performed in a vacuummagnetic field. The laminate constituting each magnetic sensing elementwas analyzed by X-ray diffraction to obtain the rocking curve of theantiferromagnetic layer (PtMn), and the rocking curve of the seed layer,the pinned magnetic layer (CoFe/Ru/CoFe), the nonmagnetic layer (Cu),and the free magnetic layer (CoFe/NiFe).

The results thereof are shown in Table 1 below. TABLE 1 X-ray source:Cu-Kβ Rocking curve of {111} plane of seed layer, Rocking curve of {111}pinned layer, free layer (CoFe), initial thickness Finished thickness ofplane of PtMn layer free layer (NiFe), and Cu layer of seed layer seedlayer 2θ Integrated intensity Half width 2θ Integrated intensity Halfwidth [A] [A] deg Cps deg Deg Cps Deg 42 35 36.21 25,312 7.1 39.3514,614 7.3 42 31 36.20 29,028 6.0 39.35 14,778 6.0 42 21 36.24 19,5556.5 39.36 13,591 6.6 42 11 36.27 12,668 6.7 39.38 13,278 6.2 42 42 36.2030,235 6.0 39.33 16,943 6.0 32 32 36.28 763 No peak 39.35 1,511 26

Among the magnetic sensing elements of the comparative examples in whichthe finished thickness is equal to the initial thickness of the seedlayer, when the thickness of the seed layer is 32 Å, which is smallerthan the critical thickness of 38 Å, the integrated intensity of therocking curve at an angle of 2θ of the X-ray diffraction peakcorresponding to the fcc {111} plane of the layer including the seedlayer is extremely low, and the half width is extremely large. Thisindicates that the crystal grain size in the in-plane direction of theseed layer is extremely small and the fcc {111} orientation is weak.When the cross section of the magnetic sensing element was checked witha transmission electron micrograph (TEM), the crystalline phaseincluding columnar grains extending through the seed layer from theupper surface to the lower surface was not observed.

On the other hand, when the seed layer composed of the(Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy is formed at 42 Å, which is larger thanthe critical thickness of 38 Å, and then the thickness is set to besmaller than or equal to the critical thickness by etching the surfaceof the seed layer, even if the finished thickness of the seed layer is38 Å or less, the integrated intensity of the rocking curve at an angleof 2θ of the X-ray diffraction peak corresponding to the fcc {111} planeof the layer including the seed layer is large, and the half width ofthe rocking curve is small. The integrated intensity and the half widthof the rocking curve are substantially equal to those of the magneticsensing element of the comparative example in which the seed layer isformed at a thickness of 42 Å.

The reason for this is that the crystal grain size in the in-planedirection of the seed layer is large, and the fce (111) orientation isstrong. When the cross section of each of such magnetic sensing elementswas checked with a TEM, the crystalline phase including columnar grainsextending through the seed layer from the upper surface to the lowersurface was observed.

Next, the crystal grain sizes of the seed layers constituting themagnetic sensing elements of the present invention were investigatedwith a TEM.

In order to fabricate each magnetic sensing element, a seed layer wasformed using a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy at a thickness of 42 Å bysputtering, and the upper surface of the seed layer was etched so thatthe thickness of the seed layer was smaller than or equal to thecritical thickness, i.e. 38 Å. Plasma etching or ion beam etching wasused to etch the seed layer. Furthermore, a structure ofantiferromagnetic layer (PtMn)/pinned magnetic layer(CoFe/Ru/CoFe)/nonmagnetic layer (Cu)/free magnetic layer(CoFe/NiFe)/protective layer (Ta) was continuously formed by sputteringon the seed layer.

By changing the amount removed from the seed layer, magnetic sensingelements having seed layers with different thicknesses were prepared.The cross section of each magnetic sensing element was checked with aTEM. The crystal gain size of the crystal grains generated in the seedlayer was visually observed and the average crystal grain size wasmeasured.

As comparative examples, magnetic sensing elements were also prepared.In order to fabricate each magnetic sensing element, a seed layer wasformed using a (Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy at a thickness of 42 Å or32 Å by sputtering, and without etching the upper surface of the seedlayer, a structure of antiferromagnetic layer (PtMn)/pinned magneticlayer (CoFe/Ru/CoFe)/nonmagnetic layer (Cu)/free magnetic layer(CoFe/NiFe)/protective layer (Ta) was continuously formed by sputteringon the seed layer. The cross sections of the magnetic sensing elementsof the comparative examples were also checked with a TEM. The crystalgrain size of the crystal grains generated in the seed layer wasvisually observed and the average crystal grain size was measured.

The results thereof are shown in Table 2 below. TABLE 2 Example 1Example 2 Example 3 Example 4 Crystal Crystal Crystal Crystal grainsize > grain size > grain size > grain size > Comparative Example 1Comparative Example 2 Finished Finished Finished Finished CrystalCrystal thickness of thickness of thickness of thickness of grain size >grain size < seed layer seed layer seed layer seed layer FinishedFinished Below critical Below critical Below critical Below criticalthickness of thickness of thickness thickness thickness thickness seedlayer seed layer 030601 030602 030603 030605 Above critical Belowcritical Deposited Deposited Deposited Deposited thickness thickness 42Å → 42 Å → 42 Å → 62 Å → 030607 020401 Finished 32 Å Finished 22 ÅFinished 12 Å Finished 12 Å Seed 42 Å Seed 32 Å Average 11.5 11.3 9.59.6 9.8 2.0 crystal grain size [nm] 3 2 4 3 7 1

Among the magnetic sensing elements of the comparative examples in whichthe finished thickness is equal to the initial thickness of the seedlayer, when the thickness of the seed layer is 32 Å, which is smallerthan the critical thickness of 38 Å, the average crystal grain size is2.0 nm (20 Å), which is smaller than the thickness of the seed layer.

On the other hand, when the seed layer composed of the(Ni_(0.8)Fe_(0.2))₆₀Cr₄₀ alloy is formed by sputtering at 42 Å, which islarger than the critical thickness of 38 Å, and then the thickness isset to be smaller than or equal to the critical thickness by etching thesurface of the seed layer, even if the finished thickness of the seedlayer is 38 Å or less, the average crystal grain size is substantiallyequal to that of the magnetic sensing element of the comparative examplein which the seed layer is formed at 42 Å.

Next, a seed layer was formed by sputtering at a thickness larger thanthe critical thickness using a NiFeCr alloy, and then the surface of theseed layer was etched so that the thickness was 30 Å, which was belowthe critical thickness of 38 Å. The average crystal grain sizes of theseed layer before and after etching were compared with each ether.

Magnetic sensing elements were fabricated for testing. In order tofabricate each magnetic sensing element, a seed Layer was formed bysputtering using a NiFeCr alloy at a thickness that was larger than thecritical thickness, and the upper surface of the seed layer was etchedso that the thickness of the seed layer was 30 Å. Subsequently, astructure of antiferromagnetic layer (PtMn)/pinned magnetic layer(CoFe/Ru/CoFe)/nonmagnetic layer (Cu)/free magnetic layer(CoFe/NiFe)/protective layer (Ta) was continuously formed by sputteringon the seed layer.

For comparison, magnetic sensing elements were also fabricated. In orderto fabricate each magnetic sensing element, without etching the seedlayer, a structure of antiferromagnetic layer (PtMn)/pinned magneticlayer (CoFe/Ru/CoFe)/nonmagnetic layer (Cu)/free magnetic layer(CoFe/NiFe)/protective layer (Ta) was continuously formed by sputteringon the seed layer. The rates of change in magnetoresistance ΔRs/Rs(ΔR/R) were compared.

The results thereof are shown in Table 3 below. TABLE 3 Dependence on Crcontent Thickness of As seed After Finished NiFeCr deposited layeretching thickness Finished Finished layer Critical Crystal as Crystal ofseed Without thickness of After thickness of Cr Fe thickness grain sizedeposited grain size layer etching seed layer etching seed layer [at %][at %] Ni [at %] Å [nm] Å [nm] Å ΔR/R % Å ΔR/R % Å Sample 1 45.0 11.044.0 49 11.0 60 11.5 30 13.2 60 14.1 30 Sample 2 42.9 11.4 45.7 45 11.060 11.4 30 13.0 60 14.0 30 Sample 3 39.4 12.1 48.5 38 11.2 60 11.3 3013.0 60 13.9 30 Sample 4 60.0 8.0 32.0 89 12.1 100 12.1 30 12.0 100 14.430 Sample 5 50.0 10.0 40.0 61 11.7 70 11.7 30 12.9 70 14.1 30Crystal grain size = Average size of crystal grains in the in-planedirection of the seed layer

Samples 1 to 5 have different Cr contents. As the Cr content increases,the critical thickness increases.

In any one of Samples 1 to 5, there is substantially no change in theaverage crystal grain size between before and after etching of the seedlayer.

In the magnetic sensing element as the example of the present inventionin which the antiferromagnetic layer, the pinned magnetic layer, thenonmagnetic layer, the free magnetic layer, and the protective layer aredeposited after the thickness of the seed layer is decreased so as to be30 Å by etching, a higher rate of change in magnetoresistance ΔRs/Rs(Rs/Rs) is achieved compared with the conventional magnetic sensingelement in which the antiferromagnetic layer, the pinned magnetic layer,the nonmagnetic layer, the free magnetic layer, and the protective layerare deposited without etching the seed layer. The reason for this isbelieved that a decrease in the thickness of the seed layer of themagnetic sensing element as the example of the present invention resultsin a reduction in shunt loss. TABLE 4 As deposited Thickness of FinishedFinished Crystal seed layer Without thickness of After thickness ofTa/NiFeCr layer Fe Ni Critical grain size as deposited etching seedlayer etching seed layer Cr [at %] [at %] [at %] thickness Å [nm] Å ΔR/R% Å ΔR/R % Å Sample 6 42.9 11.4 45.7 55 11.4 60 12.6 60 13.5 30 Sample 739.4 12.1 48.5 35 11.3 60 12.8 60 13.6 30 Sample 8 37.1 12.6 50.3 11.260 12.7 60 13.5 30 Sample 9 23.1 15.4 61.5 20 10.7 60 12.7 60 13.5 30Sample 10 13.9 17.2 68.9 17.5 10.3 60 12.0 60 12.9 30 Sample 11 0.0 20.080.0 15 9.8 60 10.9 60 11.8 30Crystal grain size = Average size of crystal grains in the in-planedirection of the seed layer

FIG. 4 shows the comparisons on the rate of change in magnetoresistanceΔRs/Rs (Rs/Rs) between magnetic sensing elements, each being fabricatedby a method in which a seed layer was formed on a Ta underlayer bysputtering at a thickness larger than the critical thickness using aNiFeCr alloy, and then without etching the seed layer, anantiferromagnetic layer, a pinned magnetic layer, a nonmagnetic layer, afree magnetic layer, and a protected layer were deposited on the seedlayer; and magnetic sensing elements as examples of the presentinvention, each being fabricated by a method in which after thethickness of the seed layer was decreased so as to be 30 Å by etching,an antiferromagnetic layer, a pinned magnetic layer, a nonmagneticlayer, a free magnetic layer, and a protected layer were deposited onthe seed layer.

When the seed layer is deposited on the Ta underlayer, the magneticsensing element as the example of the present invention has a higherrate of change in magnetoresistance ΔRs/Rs compared with theconventional magnetic sensing element in which the antiferromagneticlayer, etc., are deposited without etching the seed layer. The reasonfor this is also believed that a decrease in the thickness of the seedlayer of the magnetic sensing element as the example of the presentinvention results in a reduction in shunt loss. TABLE 5 As AfterFinished NiFeCr deposited Thickness of etching Finished Finishedthickness layer Critical Crystal seed layer Crystal thickness of Withoutthickness of After of Cr Fe Ni thickness grain size as deposited grainsize seed layer etching seed layer etching seed layer [at %] [at %] [at%] Å [nm] Å [nm] Å ΔR/R % Å ΔR/R % Å Sample 12 39.4 0.0 50.6 40 8.5 608.5 30 11.1 60 12.0 30 Sample 13 39.4 6.1 54.5 42 9.5 60 9.6 30 12.0 6012.9 30 Sample 14 39.4 12.1 48.5 45 10.6 60 10.6 30 13.0 60 13.9 30Sample 15 39.4 18.2 42.4 46 11.7 60 11.7 30 13.3 60 14.2 30 Sample 1650.0 0.0 50.0 58 9.2 70 9.2 30 11.4 70 12.4 30 Sample 17 50.0 5.0 45.072 10 80 10.1 30 11.2 80 13.3 30 Sample 18 50.0 10.0 40.0 85 11 100 11.030 11.0 100 14.3 30 Sample 19 50.0 15.0 35.0 96 11.8 110 11.9 30 10.5110 14.6 30Crystal grain size = Average size of crystal grains in the in-planedirection of the seed layer

Table 5 shows the comparison results on the average crystal sizes of theseed layers. The seed layers were formed by sputtering at thicknesseslarger than the critical thicknesses using NiFeCr alloys with a constantCr content and varied Fe contents, and the thicknesses were decreased byetching so as to be smaller than the critical thicknesses. The averagecrystal sizes were measured before and after etching the seed layers.

Comparisons were also performed on the rate of change inmagnetoresistance ΔRs/Rs between magnetic sensing elements, each beingformed by a method in which the seed layer was formed by sputtering at athickness larger than the critical thickness, and then, without etchingthe seed layer, an antiferromagnetic layer, a pinned magnetic layer; anonmagnetic layer, a free magnetic layer, and a protective layer weredeposited, and magnetic sensing elements as the examples of the presentinvention, each being formed by a method in which after the seed layerwas etched, an antiferromagnetic layer, a pinned magnetic layer, anonmagnetic layer, a free magnetic layer, and a protective layer weredeposited.

With the Cr content being constant, as the Fe content increases, thecritical thickness increases.

In any one of Samples 12 to 19, the average crystal grain size of theseed layer is not substantially changed before and after etching theseed layer.

In the magnetic sensing element as the example of the present inventionin which the antiferromagnetic layer, the pinned magnetic layer, thenonmagnetic layer, the free magnetic layer, and the protective layer aredeposited after the thickness of the seed layer is decreased so as to be30 Å by etching, a higher rate of change in magnetoresistance ΔRs/Rs isachieved compared with the conventional magnetic sensing element inwhich the antiferromagnetic layer, the pinned magnetic layer, thenonmagnetic layer, the free magnetic layer, and the protective layer aredeposited without etching the seed layer. The reason for this isbelieved that a decrease in the thickness of the seed layer of themagnetic sensing element as the example of the present invention resultsin a reduction in shunt loss.

Next, seed layers were formed using (Ni_(0.8)Fe_(0.2))_(100-x)Cr_(x)alloys, wherein x is the Cr content in atomic percent, with different Crcontents. On each seed layer, a structure of antiferromagnetic layer[PtMn (120 Å)]/pinned magnetic layer (CoFe (16 Å)/Ru (8.7 Å)/CoFe (22Å)]/nonmagnetic layer [Cu (21 Å)]/free magnetic layer [CoFe (10 Å)/NiFe(18 Å)]/back layer [Cu (10 Å)]/protective layer [Ta (30 Å)] wasdeposited.

By changing the thickness of the seed layer, the thickness at thecritical point below which the unidirectional exchange bias magneticfield Hex*, the change in resistance ΔRs, and the rate of change inresistance ΔRs/Rs rapidly decrease was measured. The thickness at thecritical point was shown as the critical thickness of the Seed layer inthe graph of FIG. 17.

As is evident from FIG. 17, as the Cr content in the(Ni_(0.8)Fe_(0.2))_(100-x)Cr_(x) alloy increases, the critical thicknessof the seed layer increases. For example, at a Cr content of 60 atomicpercent, the critical thickness is 89 Å; at a Cr content of 50 atomicpercent, the critical thickness is 61 Å at a Cr content of 45 atomicpercent, the critical thickness is 49 Å, at a Cr content of 40 atomicpercent, the critical thickness is 38 Å, at a Cr content of 39 atomicpercent, the critical thickness is 35 Å; and at a Cr content of 35atomic percent, the critical thickness is 30 atomic percent.

FIG. 17 also shows the critical thickness of the seed layers, each seedlayer being formed on an underlayer composed of Ta (32 Å) using a(Ni_(0.8)Fe_(0.2))_(100-x)Cr_(x) alloy with a different Cr content, astructure of antiferromagnetic layer [PtMn (120 Å)]/pinned magneticlayer [CoFe (16 Å)/Ru (8.7 Å)/CoFe (22 Å)]/nonmagnetic layer [Cu (21Å)]/free magnetic layer [CoFe (10 Å)/NiFe (18 Å)]/back layer [Cu (10Å)/protective layer [Ta (30 Å)] being deposited on the seed layer.

When a seed layer is formed on an underlayer composed of Ta using a(Ni_(0.8)Fe_(0.2))_(100-x)Cr_(x) alloy, wherein x is the Cr content inatomic percent, it is possible to form a seed layer using a NiFeCr alloywith a lower Cr content compared with the case in which an underlayer isnot used, and thereby the critical thickness can be decreased. Forexample, when the Cr content in the (Ni_(0.8)Fe_(0.2))_(100-x)Cr_(x)alloy is 23 atomic percent, the critical thickness is 20 Å. When the Crcontent is 14 atomic percent, the critical thickness is 17.5 Å.

FIG. 18 is a graph which shows the relationships among the Cr content inthe seed layer composed of a (Ni_(0.8)Fe_(0.2))_(100-x)Cr_(x) alloy,wherein x is the Cr content in atomic percent, the thickness of the seedlayer as deposited, and the average crystal grain size of thecrystalline phase generated in the seed layer.

As is evident from FIG. 18, when the seed layer composed of a NiFeCralloy is deposited at a thickness larger than the critical thickness, ifthe Cr content is increased, the size of crystal grains formed in theseed layer can be increased.

If the Cr content in the NiFeCr alloy is 45 atomic percent or less, thecritical thickness of the seed layer is 49 Å or less. Consequently, ifthe seed layer is formed at a thickness of 50 Å or more, the averagegain size of the crystalline phase generated in the seed layer increasesin proportion to the Cr content. However, when the Cr content is set at50 atomic percent (critical thickness: 61 Å) or 60 atomic percent(critical thickness: 89 Å), the average crystal grain size of thecrystalline phase generated in the seed layer is rapidly decreasedunless the seed layer is formed at a thickness larger than the criticalthickness, for example, at 70 Å or 100 Å.

FIG. 19 is a graph which shows the relationships among the Cr content inthe seed layer composed of a (Ni_(0.8)Fe_(0.2))_(100-x)Cr_(x) alloy,wherein x is the Cr content in atomic percent, the thickness of the seedlayer as deposited, and the rate of change in magnetoresistance ΔRs/Rsof a magnetic sensing dement fabricated by depositing a structure ofantiferromagnetic layer [PtMn (120 Å)]/pinned magnetic layer; CoFe (16Å)/Ru (8.7 Å)/CoFe (22 Å)]/nonmagnetic layer [Cu (21 Å)]/free magneticlayer [CoFe (10 Å)/NiFe (18 Å)]/back layer [Cu (10 Å)]/protective layer[Ta (30 Å)] on the seed layer.

As is evident from FIG. 19, at a Cr content of 50 atomic percent(critical thickness: 61 Å) or 60 atomic percent (critical thickness: 89Å), if the seed layer is deposited at 70 Å or 100 Å, which is largerthan the critical thickness, the rate of change in magnetoresistanceΔRs/Rs does not increase in proportion to the Cr content of the seedlayer. The reason for this is that an increase in the thickness of theseed layer results in an increase in the shunt loss of the sensingcurrent.

FIG. 20 is a graph which shows the relationships among the Cr content inthe seed layer composed of a (Ni_(0.8)Fe_(0.2))_(100-x)Cr_(x) alloy,wherein x is the Cr content in atomic percent, the thickness of the seedlayer as deposited, and the average crystal grain size of thecrystalline phase generated in the seed layer when the seed layer isdeposited at a thickness larger than the critical thickness and then thethickness of the seed layer is decreased so as to be 30 Å by plasmaetching (inverse sputtering) or ion beam etching.

As is evident from FIG. 20, when the seed layer is deposited at athickness (NiFeCr initial thickness) that is larger than the criticalthickness and then the thickness of the seed layer is decreased so as tobe 30 Å, which is below the critical thickness, it is possible toincrease the crystal grain size of the crystal grains formed in the seedlayer.

FIG. 21 is a graph a graph which shows the relationships among theContent in the seed layer composed of a (Ni0.8Fe0.2)100-xCr-x alloy,wherein x is the Cr content in atomic percent, the thickness of the seedlayer as deposited NiFeCr initial thickness), and the rate of change inmagnetoresistance ΔRs/Rs of a magnetic sensing element fabricated bydepositing a structure of antiferromagnetic layer [PtMn (120 Å)]/pinnedmagnetic layer [CoFe (16 Å)/Ru (8.7 Å)/CoFe (22 Å)]/nonmagnetic layer[Cu (21 Å]/free magnetic layer [CoFe(10 Å)/NiFe (18 Å]/back layer [Cu(10 Å)]/protective layer [Ta (30 Å)] on the seed layer after the seeddeposited at a thickness larger than the critical thickness is etched byplasma etching (inverse sputtering) oion beam etching so that thicknessis 30 Å which is below the critical thickness.

As is evident from FIG. 21, when the seed layer is deposited at athickness (NiFeCr initial thickness) that is larger than criticalthickness and then the seed layer is etched so that the thickness isbelow the critical thickness, it si possible to increase the rate ofchange in magnetoresistance ΔRs/Rs of the magnetic sensing element inproportion to the Cr content.

Next, a seed layer was formed using a Ni61-xFexCr39 alloy, wherein x isthe Fe content in atomic percent, and then a structure ofantiferromagnetic layer [PtMn (120 Å)]/pinned magnetic layer [CoFe (16Å/Ru (8.7 Å)/CoFe (22 Å)]/nonmagnetic layer [Cu (21 Å0)]/free magneticlayer [CoFe (10 Å)/NiFe (18 Å)]/back layer [Cu (10 Å]/back layer [Cu (10Å)]/protective layer [Ta (30 Å)] was deposited on the seed layer.

By changing the thickness of the seed layer, the thickness at thecritical point below which the unidirectional exchange bias magneticfield Hex*, the change in resistance DRS, and the rate of change inmagnetoresistance ΔRs/Rs (ΔR/R) rapidly decrease was measured. Thethickness at the critical point was shown as the critical thickness ofthe seed layer in the graph of FIG. 22.

As is evident from FIG. 22, as the Fe content in the Ni_(61-x)Fe_(x)Cr₃₉alloy, wherein x is the Fe content in atomic percent, increases, thecritical thickness of the seed layer increases. For example, at an Fecontent of 18 atomic percent, the critical thickness is 46 Å; and at anFe content of 6 atomic percent, the critical thickness if 42 Å.

Additionally, the critical thickness of the Ni₆₁Cr₃₉ alloy which doesnot contain Fe is 40 Å.

FIG. 22 also shows the critical thickness of the seed layer formed usinga Ni_(50-x)Fe_(x)Cr₅₀, wherein x is the Fe content in atomic percent, astructure of antiferromagnetic layer [PtMn (120 Å)]/pinned magneticlayer [CoFe (16 Å)/Ru (8.7 Å)/CoFe (22 Å)]/nonmagnetic layer [Cu (21Å)]/free magnetic layer [CoFe (10 Å)/NiFe (18 Å)]/back layer (Cu (10Å)/protective layer (Ta (30 Å)] being deposited on the seed layer.

For example, at an Fe content of 15 atomic percent, the criticalthickness is 96 Å; and at an Fe content of 5 atomic percent, thecritical thickness is 72 Å.

Additionally, the critical thickness of the Ni₅₀Cr₅₀ alloy which doesnot contain Fe is 58 Å. In the NiFeCr alloy, as the Cr contentincreases, the rate of increase in the critical thickness(proportionality factor) with the Fe content increases.

In the NiCr alloy which does not contain Fe, as the Cr contentincreases, the critical thickness also increases.

FIG. 23 is a graph which shows the relationships among the Fe content ofthe NiFeCr alloy constituting the seed layer, the thickness of the seedlayer as deposited (seed layer thickness), and the average crystal grainsize of the crystalline phase generated in the seed layer, when the seedlayer is formed using a Ni_(61-x)Fe_(x)Cr₃₉ alloy or Ni_(50-x)Fe_(x)Cr₅₀alloy, wherein x is the Fe content in atomic percent.

As is evident from FIG. 23, in the seed layer composed of the NiFeCralloy, if the seed layer is deposited at a thickness larger than thecritical thickness, the crystal grain size of the crystal grains formedin the seed layer can be increased by increasing the Fe content.

When the seed layer is formed at a thickness of 60 Å using aNi_(61-x)Fe_(x)Cr₃₉ alloy, in the range shown in FIG. 23, since thethickness of the seed layer is larger than the critical thickness, theaverage crystal grain size of the seed layer increases in proportion tothe Fe content.

On the other hand, when the seed layer is formed using aNi_(50-x)Fe_(x)Cr₅₀ alloy, wherein x is the Fe content in atomicpercent, the average crystal grain size of the seed layer rapidlydecreases unless the seed layer is deposited at 80 Å or 100 Å, which islarger than the critical thickness.

FIG. 24 is a graph which shows the relationships among the Fe content inthe NiFeCr alloy constituting the seed layer, the thickness of the seedlayer as deposited (seed layer thickness), and the rate of change inmagnetoresistance ΔRs/Rs (ΔR/R) when the seed layer is formed using aNi_(61-x)Fe_(x)Cr₃₉ alloy or Ni_(50-x)Fe_(x)Cr₅₀ alloy, wherein x is theFe content in atomic percent, and a structure of antiferromagnetic layer[PtMn (120 Å)]/pinned magnetic layer (CoFe (16 Å)/Ru (8.7 Å)/CoFe (22Å)]/nonmagnetic layer [Cu (21 Å)]/free magnetic layer [CoFe (10 Å)/NiFe(18 Å)]/back layer [Cu (10 Å)]/protective layer [Ta (30 Å)] is depositedon the seed layer to fabricate a magnetic sensing element.

As is evident from FIG. 24, when the seed layer is deposited at athickness of 50 Å using a Ni_(61-x)Fe_(x)Cr₃₉ alloy, the rate of changein magnetoresistance ΔRs/Rs (ΔR/R) of the magnetic sensing elementincreases in proportion to the Fe content.

However, in the seed layer composed of a Ni_(50-x)Fe_(x)Cr₅₀ alloy, whenthe Fe content is set at 5 atomic percent (critical thickness: 72 Å), 10atomic percent (critical thickness: 85 Å), or 15 atomic percent(critical thickness: 96 Å), if the seed layer is deposited at 80 Å, 100Å, or 110 Å, which is larger than the critical thickness, the rate ofchange in magnetoresistance ΔRs/Rs (ΔR/R) of the magnetic sensingelement does not increase in proportion to the Fe on content. The reasonfor this is that an increase in the thickness of the seed layer resultsin an increase in the shunt loss of the sensing current.

FIG. 25 is a graph which shows the relationships among the Fe content inthe NiFeCr alloy, the thickness of the seed layer as deposited (seedlayer thickness), and the average crystal grain size of the crystallinephase generated in the seed layer when the seed layer is formed using aNi_(61-x)Fe_(x)Cr₃₉ alloy or Ni_(50-x)Fe_(x)Cr₅₀ alloy, wherein x is theFe content in atomic percent, and then the thickness of the seed layeris decreased so as to be 30 Å, which is below the critical thickness, byplasma etching (inverse sputtering) or ion beam etching.

As is evident from FIG. 25, in the seed layer composed of the NiFeCralloy, when the seed layer is deposited at a thickness larger than thecritical thickness and then the thickness is decreased so as to be belowthe critical thickness, the size of the crystal grains formed in theseed layer can be increased in proportion to the Fe content.

When the composition ratio of the NiFeCr alloy is the same, the averagecrystal grain size of the seed layer as deposited is substantially thesame as that of the seed layer subjected to the etching step.

FIG. 26 is a graph which shows the relationships among the Fe content inthe NiFeCr alloy constituting the seed Layer, the thickness of the seedlayer as deposited (seed layer thickness), and the rate of change inmagnetoresistance ΔRs/Rs (ΔR/R) of the magnetic sensing element when theseed layer is formed using a Ni_(61-x)Fe_(x)Cr₃₉ alloy orNi_(50-x)Fe_(x)Cr₅₀ alloy, wherein x is the Fe content in atomicpercent; the thickness of the seed layer is decreased so as to be 30 Å,which is below the critical thickness, by plasma etching (inversesputtering) or ion beam etching; and a structure of antiferromagneticlayer [PtMn (120 Å)]/pinned magnetic layer [CoFe (16 Å)/Ru (8.7 Å)/CoFe(22 Å)]/nonmagnetic layer [Cu (21 Å)]/free magnetic layer [CoFe (10Å)/NiFe (18 Å)]/back layer [Cu (10 Å)]/protective layer [Ta (30 Å)] isdeposited on the seed layer to fabricate a magnetic sensing element.

As is evident from FIG. 26, when the seed layer is deposited at athickness larger than the critical thickness and then the thickness isdecreased so as to be below the critical thickness by etching, it ispossible to increase the rate of change in magnetoresistance ΔRs/Rs(ΔR/R) of the magnetic sensing element in proportion to the Fe content.

When the composition ratio of the NiFeCr alloy is the same, the rate ofchange in magnetoresistance ΔRs/Rs (ΔR/R) of the magnetic sensingelement formed on the seed layer with the thickness of 30 Å, which isobtained by etching after the deposition, is larger than the rate ofchange in magnetoresistance ΔRs/Rs (ΔR/R) of the magnetic sensingelement formed on the seed layer with the thickness as deposited.

The reason for this is that a decrease in the thickness of the seedlayer results in a reduction in shunt loss of the sensing current.

When a magnetic sensing element is formed on the seed layer deposited ata thickness of 50 Å using a Ni₆₁Cr₃₉ alloy which does not contain Fe,the rate of change in magnetoresistance ΔRs/Rs (ΔR/R) is 11.1%. When amagnetic sensing element is formed on the seed layer deposited at athickness of 50 Å using a Ni₆₁Cr₃₉ alloy, the thickness of the seedlayer being decreased so as to be 30 Å by etching, the rate of change inmagnetoresistance ΔRs/Rs (ΔR/R) is 12.0%.

When a magnetic sensing element is formed on the seed layer deposited ata thickness of 70 Å using a Ni₅₀Cr₅₀ alloy which does not contain Fe,the rate of change in magnetoresistance ΔRs/Rs (ΔR/R) is 11.4%. When amagnetic sensing element is formed on the seed layer deposited at athickness of 70 Å using a Ni₅₀Cr₅₀ alloy, the thickness of the seedlayer being decreased so as to be 30 Å by etching, the rate of change inmagnetoresistance ΔRs/Rs (ΔR/R) is 12.4%.

The fabrication of the magnetic sensing element including a seed layercomposed of a NiCr alloy or NiFeCr alloy with a Cr content of 40 atomicpercent or more with a thickness that is larger than 0 Å and smallerthan or equal to 38 Å as described above has been achieved for the firsttime by the present invention.

The fabrication of the magnetic sensing element including a seed layercomposed of a NiCr alloy or NiFeCr alloy with a Cr content of 35 atomicpercent or more with a thickness that is larger than 0 Å and smallerthan or equal to 30 Å has also been achieved for the first time by thepresent invention.

However, if the thickness of the seed layer is excessively large, ittakes a long time to form the seed layer, resulting in adverse effects,such as an increase in the thickness of the magnetic sensing element andan increase in shunt loss. Consequently, in the present invention, thethickness of the seed layer is preferably 60 Å or less, and morepreferably 50 Å or less.

While the present invention has been described with reference to whatare presently considered to be the preferred embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments. On the contrary, the invention is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims. For example, the present invention is alsoapplicable to a current-perpendicular-to-the-plane (CPP) type GMRmagnetic sensing element in which electrodes are provided on the top andbottom of a laminate constituting the magnetic sensing element and asensing current flows perpendicular to the planes of the individuallayers constituting the laminate.

1-16. (canceled)
 17. A method for making an exchange-coupled filmcomprising the steps of: (a) forming a seed layer at a thickness that islarger than a critical thickness so that a crystalline phase extendsthrough from a upper surface to a lower surface of the seed layer; (b)etching the upper surface of the seed layer so that the thickness of theseed layer is smaller than or equal to the critical thickness; and (c)depositing an antiferromagnetic layer and a ferromagnetic layer on theseed layer.
 18. A method for making an exchange-coupled film comprisingthe steps of: (d) forming a seed layer with a crystalline phase at athickness that is larger than a critical thickness; (e) etching asurface of the seed layer so that the thickness of the seed layer issmaller than or equal to the critical thickness and so that an averagesize, in a direction parallel to the layer surface, of the crystalgrains in the seed layer is larger than the thickness of the seed layer;and (f) depositing an antiferromagnetic layer and a ferromagnetic layeron the seed layer.
 19. The method for making the exchange-coupled filmaccording to claim 17, wherein in said step (a), the seed layer isformed with a metal material which has a face-centered cubic structureand a crystalline phase in which the equivalent crystal planerepresented as {111} plane is preferentially oriented parallel to aninterface between the antiferromagnetic layer and the ferromagneticlayer.
 20. The method for making the exchange-coupled film according toclaim 17, wherein the seed layer is formed with a NiCr alloy or a NiFeCralloy.
 21. A method for making an exchange-coupled film comprising thesteps of: (g) forming a seed layer at a thickness that is larger than acritical thickness with a NiCr alloy or a NiFeCr alloy having a Crcontent of 35 to 60 atomic percent; (h) etching a surface of the seedlayer so that the thickness of the seed layer is smaller than or equalto the critical thickness; and (i) depositing an antiferromagnetic layerand a ferromagnetic layer on the seed layer.
 22. The method for makingthe exchange-coupled film according to claim 20, wherein the Cr contentin the NiCr alloy or the NiFeCr alloy is 40 to 60 atomic percent, and insaid step (b), the seed layer is etched so that the thickness of theseed layer is larger than 0 Å and smaller than or equal to 38 Å.
 23. Themethod for making the exchange-coupled film according to claim 20,wherein the Cr content in the NiCr alloy or the NiFeCr alloy is 35 to 60atomic percent, and in said step (b), the seed layer is etched so thatthe thickness of the seed layer is larger than 0 Å and smaller than orequal to 30 Å.
 24. The method for making the exchange-coupled filmaccording to claim 21, wherein the Cr content in the NiCr alloy or theNiFeCr alloy is 50 atomic percent or less.
 25. The method for making theexchange-coupled film according to claim 22, wherein in the NiFeCralloy, the Fe/Ni atomic ratio is greater than 0/100 and less than orequal to 30/70.
 26. The method for making the exchange-coupled filmaccording to claim 22, wherein in said step (b), the thickness of theseed layer is set at 6 Å or more.
 27. The method for making theexchange-coupled film according to claim 26, wherein in said step (b),the thickness of the seed layer is set at 12 Å or more.
 28. A method formaking an exchange-coupled film comprising the steps of: (a) forming aseed layer at a thickness that is larger than a critical thickness sothat a crystalline phase extends through from an upper surface to alower surface of the seed layer; (b) etching the upper surface of theseed layer so that the thickness of the seed layer is smaller than orequal to the critical thickness; and (j) depositing a ferromagneticlayer on the seed layer.